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The Diffusion of Solids

John H. Howell
- 01 Mar 1906 - 
- Vol. 73, Iss: 1898, pp 464-464
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TLDR
In view of the interest attaching to the vaporisation and diffusion of solids, the following observations may be worthy of record as discussed by the authors, which may be seen as a good starting point for further research.
Abstract
IN view of the interest attaching to the vaporisation and diffusion of solids, the following observations may be worthy of record.

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Citations
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A review of conduction phenomena in Li-ion batteries

TL;DR: A comprehensive survey of conduction phenomena in all components of a Li-ion cell incorporating theoretical, experimental, and simulation studies is presented in this paper, where the critical results, issues and challenges with respect to ionic and electronic conduction in the cathode, anode and electrolyte are discussed.
Journal ArticleDOI

Criteria for developing castable, creep-resistant aluminum-based alloys - A review

TL;DR: In this paper, the authors describe four criteria for the selection of alloying elements capable of producing castable, precipitation-strengthened Al alloys with high-temperature stability and strength.
Journal ArticleDOI

Intermetallic Nanocrystals: Syntheses and Catalytic Applications

TL;DR: Recent progress in the synthesis of intermetallic nanocrystals with controllable sizes and well-defined shapes is highlighted and perspectives on future developments in the context of synthetic control, structure-property relationships, and applications are discussed.
Journal ArticleDOI

Shear localization in dynamic deformation of materials: microstructural evolution and self-organization

TL;DR: In this article, the authors investigated the microstructural evolution inside the shear bands and found that they exhibit a clear self-organization, with a characteristic spacing that is a function of a number of parameters.
References
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Journal ArticleDOI

Kinetics of intermetallic compound layer growth and interfacial reactions between Sn-8Zn-5In solder and bare copper substrate

TL;DR: In this article, the growth kinetics of the intermetallic compound layer formed between Sn−8Zn−5 in solder and bare Cu substrate by solid-state isothermal aging were examined at temperatures between 70 and 150°C for times up to 100 days.
Dissertation

Quantifying Isothermal Solidification Kinetics during Transient Liquid Phase Bonding using Differential Scanning Calorimetry

Michael Kuntz
TL;DR: In this article, the authors present a list of tables, acknowledgements, dedications, and figures for each of the tables and the figures of the figures in the table and the acknowledgements.
Journal ArticleDOI

Physical Model for Plaque Action in the Tooth-Plaque-Saliva System

TL;DR: A physical model describing the interrelationships of demineralization, remineralized, plaque thickness, glucose levels, and plaque enzymatic activity was presented and the results were discussed and correlated with the results of in vivo studies.
Journal ArticleDOI

Fabrication and Characterization of High-Bonding-Strength Al/Ti/Al-Laminated Composites via Cryorolling

TL;DR: In this article, Al/Ti/Al-laminated composites were fabricated by hot roll bonding and subsequent processes: cryorolling (− 190°C and − 100°C), cold rolling (25 °C) and hot rolling (300 ÂC), and their bonding strength and mechanical properties were studied by an Autograph AGS-X universal electronic testing machine.

Solid-state diffusion and NMR

TL;DR: In this article, the authors review case studies for various solids like glassy and crystalline aluminosilicates, nanocrystalline composites, an intercalation compound and a simple bcc metal.