Thermal cooling enhancement of dual processors computer with thermoelectric air cooler module
TLDR
In this paper, the thermal cooling enhancement technique of dual processors workstation computer couple thermoelectric air cooler module is studied experimentally, and the results of this study are expected to lead to guidelines that will allow the design of the cooling system with improved heat transfer performance of the electronic equipment.About:
This article is published in Case Studies in Thermal Engineering.The article was published on 2019-09-01 and is currently open access. It has received 32 citations till now. The article focuses on the topics: Water cooling & Evaporative cooler.read more
Citations
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Thermoelectric cooler and thermoelectric generator devices: A review of present and potential applications, modeling and materials
Seyed Mohsen Pourkiaei,Mohammad Hossein Ahmadi,Milad Sadeghzadeh,Soroush Moosavi,Fathollah Pourfayaz,Lingen Chen,Mohammad Arab Pour Yazdi,Ravinder Kumar +7 more
TL;DR: The principles of thermoelectricity are described and an explanation of current and upcoming materials are presented and developed models and various performed optimization of thermOElectric applications by using non-equilibrium thermodynamics and finite time thermodynamics are discussed.
Journal ArticleDOI
Comprehensive study on nanofluid and ionanofluid for heat transfer enhancement: A review on current and future perspective
Balaji Bakthavatchalam,Khairul Habib,Rahman Saidur,Rahman Saidur,Bidyut Baran Saha,Kashif Irshad +5 more
TL;DR: In this article, the authors summarized the preparation, thermophysical and hydrothermal properties, mechanisms, factors responsible for obtaining stable and enhanced thermophysical properties furthermore and its benefits on integration with heat transfer applications.
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Thermoelectric Coolers: Progress, Challenges, and Opportunities.
Wen-Yi Chen,Jin Zou,Zhigang Chen +2 more
TL;DR: The significant progress of state-of-the-art thermoelectric coolers is comprehensively summarized and the related aspects of materials, fundamental design, heat sinks, and structures, are overviewed.
Journal ArticleDOI
Thermal management system of CPU cooling with a novel short heat pipe cooling system
TL;DR: In this paper, the effects of the relevant parameters; inclination angle of heat pipe, with and without porous media, working fluid types and operating conditions of computer on the variation of CPU temperature are considered.
Journal ArticleDOI
Heat transfer enhancement of thermoelectric cooling module with nanofluid and ferrofluid as base fluids
TL;DR: In this article, the thermal performance of a compact heat sink thermoelectric cooling module with water, nanofluid, and ferrofluid as the coolants is investigated experimentally.
References
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Experimental investigation of convective heat transfer augmentation for car radiator using ZnO–water nanofluids
TL;DR: In this paper, water-based nanofluids have been used to enhance the heat transfer performance of a car radiator by adding ZnO nanoparticles to base fluid in different volumetric concentrations (0.01, 0.08), 0.2% and 0.3%).
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Experimental investigation of heat transfer and pressure drop in a straight minichannel heat sink using TiO2 nanofluid
TL;DR: In this article, heat transfer and pressure drop characteristic associated with minichannel heat sink is investigated experimentally and the results indicate that TiO2 nanofluid thermal performance is strongly dependent on heating power and its usefulness heat transfer characteristic could be achieved more effectively at lower heating power.
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Water cooled minichannel heat sinks for microprocessor cooling: Effect of fin spacing
TL;DR: In this article, five different heat sinks with fin spacings of 0.2mm, 0.5mm, 1.0mm, and 1.5 mm along with a flat plate heat sink were investigated.
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Effect of channel angle of pin-fin heat sink on heat transfer performance using water based graphene nanoplatelets nanofluids
Hafiz Muhammad Ali,Waqas Arshad +1 more
TL;DR: In this paper, the authors examined the angle effect of pin fin heat sink channel in terms of convective heat transfer coefficient, log mean temperature difference and thermal resistance using water-based graphene nanoplatelets (GNPs) nanofluids in a flow rate range of 0.25-0.75 LPM.
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Application of nanofluids to a heat pipe liquid-block and the thermoelectric cooling of electronic equipment
TL;DR: In this article, the application of nanofluids as the working fluid on a heat pipe liquid-block combined with thermoelectric cooling is investigated, and the results obtained from this technique are compared to those from other conventional cooling techniques.