A Novel Approach for Cooling Electronics Using a Combined Heat Pipe and Thermoelectric Module
Reads0
Chats0
TLDR
In this article, the authors presented a numerical analysis of a novel cooling system for electronics, which was based on use of computational fluid dynamics and results obtained in terms of cooling efficiencies were compared to those of the traditional cooling.Abstract:
The development of effective cooling systems for microprocessors, specifically for CPU and other computer chips, is greatly important due to growth of high speed performance chips, which operate at elevated heat rates. The same issues apply for adjacent units including RAM and HDD also contributing to overall generation of heat inside computer. Problem statement: Conventional cooling system for desktop PC has many problems, especially cooling performance. Lifespan of devices and reliable operation are largely dependent on junction temperature. Total power dissipation of recently introduced, new generation microprocessors had been increasing rapidly, pushing desktop system cooling technology close to its limits. Approach: Present research focused on a system for removal of dissipated heat that combined the advantages of heat pipe and thermoelectric modules. Proposed research presented a numerical analysis of a novel cooling system for electronics. Configuration studied concerns microprocessors and other computer ships. Simulations performed in this research were based on use of computational fluid dynamics and results obtained in terms of cooling efficiencies were compared to those of the traditional cooling. Heat resistance and temperature of each component were investigated in this modeling. Results: Lowest core temperature was found below 75°C and total thermal resistance of cooling system is 0.095°C/W. Conclusion/Recommendations: Proposed cooling systems had sufficient capacity for cooling 200 W heat dissipation. Temperature of proposed cooling system is lower than both existing cooling systems. Temperature of all components, CPU, heat pipe, TEC and heat sink were below 75°C. Thermal resistance characteristic of a cooling system had a major effect on cooling performance.read more
Citations
More filters
Journal ArticleDOI
A critical review of traditional and emerging techniques and fluids for electronics cooling
TL;DR: In this paper, a critical review of traditional and emerging cooling methods as well as coolants for electronics is provided, summarizing traditional coolants, heat transfer properties and performances of potential new coolants such as nanofluids are also reviewed and analyzed.
Journal ArticleDOI
Analyzing of Thermoelectric Refrigerator Performance
TL;DR: In this paper, a thermoelectric refrigerator (TER; 25 × 25 × 35 cm3) was fabricated by using a TEC; 4 × 4 cm2 and applied electrical power of 40 W. The temperature of TER was measured at ten points to check the cooling system.
Journal ArticleDOI
Experimental analysis and FEM simulation of finned U-shape multi heat pipe for desktop PC cooling
TL;DR: In this paper, the performance analysis of a finned U-shape heat pipe used for desktop PC-CPU cooling is presented by mounting the system vertically over a heat source situated inside a rectangular tunnel, and force convection is facilitated by means of a blower.
Journal ArticleDOI
Characterization of working fluid in vertically mounted finned U-shape twin heat pipe for electronic cooling
TL;DR: In this article, a two-dimensional FE simulation is performed under both natural and forced convection modes, by using an ansys-flotran, and the best heat input and coolant velocity for the simulations are determined experimentally, corresponding to the least thermal resistance.
Journal ArticleDOI
Nanofluids for the Next Generation Thermal Management of Electronics: A Review
TL;DR: The use on those cooling systems of the novel heat transfer fluids named nanofluids are described, which make those innovative fluids very promising for the thermal management of electronic components, devices and systems.
References
More filters
Journal ArticleDOI
Heat pipes in modern heat exchangers
TL;DR: In this paper, a review of heat pipe developments in the former Soviet Union countries is presented, and some new results obtained in USA and Europe are also included in the review. But none of the results are available for the former USSR.
Journal ArticleDOI
Cooling of mobile electronic devices using phase change materials
F.L. Tan,Chih Ping Tso +1 more
TL;DR: In this paper, an experimental study was conducted on the cooling of mobile electronic devices, such as personal digital assistants (PDAs) and wearable computers, using a heat storage unit (HSU) filled with the phase change material (PCM) of n-eicosane inside the device.
Patent
Thermoelectric cooling system
TL;DR: In this article, a thermoelectric cooling system with an electric circuit including a direct current power source providing direct current through the electric circuit, and a control assembly comprising a thermostat control switch mechanism and a resistive element connected to each other in parallel is described.
Journal ArticleDOI
Measurements and simulations of transient characteristics of heat pipes
TL;DR: The main purpose of this study is to determine the effective heat pipe thermal conductivity in transient state during start up the pipe operation and temperature increase.
Proceedings ArticleDOI
Rapid design of heat sinks for electronic cooling using computational and experimental tools
S. Subramanyam,Keith E. Crowe +1 more
TL;DR: In this article, the authors describe the tools and methods for evaluating designs of electronic cooling heat sinks using thermal finite element analysis (FEA) and computational fluid dynamics (CFD).
Related Papers (5)
Performance analysis and experimental study on thermoelectric cooling system coupling with heat pipe
Wang Yu,Shi Yushu,Di Liu +2 more