Journal ArticleDOI
Transient thermal response of power semiconductors to short power pulses
TLDR
In this article, an alternative model is derived, the limits of its accuracy are estimated, and a correction factor is described for large surges of short time duration, as they are encountered in present day power conditioning systems.Abstract:
Thermal response curves used to calculate the peak junction temperature of power semiconductors are normally derived by experimental identification of the parameters of a known model. Unfortunately the model, developed many years ago, is inappropriate for large surges of short time duration, as they are encountered in present day power conditioning systems. An alternative model is derived, the limits of its accuracy are estimated, and a correction factor is described. A verification of the accuracy of the two methods is also presented. For pulse widths shorter than the thermal transit time, which is in the order of 300 mu s, the peak junction temperature can be more accurately calculated with an expression derived in the present work, which takes into consideration the active volume in which the heat is generated, than with the transient thermal response curve. A correction factor, a function of the width of the pulse, inserted in this equation, further improves its accuracy. >read more
Citations
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Energy Dissipation and Transport in Nanoscale Devices
TL;DR: In this article, the authors present recent progress in understanding and manipulation of energy dissipation and transport in nanoscale solid-state structures, including silicon transistors, carbon nanostructures, and semiconductor nanowires.
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Choosing a thermal model for electrothermal simulation of power semiconductor devices
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Transient temperature measurements and modeling of IGBT's under short circuit
TL;DR: In this article, an experimental method is presented to estimate the temperature decay in the IGBT from the saturation current response at low gate-to-source voltage during the cooling phase.
References
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Book
Conduction of Heat in Solids
H. S. Carslaw,John Conrad Jaeger +1 more
TL;DR: In this paper, a classic account describes the known exact solutions of problems of heat flow, with detailed discussion of all the most important boundary value problems, including boundary value maximization.
Journal ArticleDOI
Flash Method of Determining Thermal Diffusivity, Heat Capacity, and Thermal Conductivity
TL;DR: In this paper, a high-intensity short-duration light pulse is absorbed in the front surface of a thermally insulated specimen, and the resulting temperature history of the rear surface is measured by a thermocouple and recorded with an oscilloscope and camera.
Journal ArticleDOI
Transient Thermal Response Measurements of Power Transistors
TL;DR: In this article, a one-dimensional model for power transistor cooling is described and the theoretical predictions of the model are shown to be in good agreement for practical applications with three-dimensional computer simulations and experimental results.
Journal ArticleDOI
Three-dimensional transient thermal simulation: application to delayed short circuit protection in power ICs
TL;DR: An analytical solution of the three-dimensional transient thermal diffusion problem is presented for a two-layer structure, together with a simple computer program for the calculation of the solution.