D
Daniel Erni
Researcher at University of Duisburg-Essen
Publications - 335
Citations - 4472
Daniel Erni is an academic researcher from University of Duisburg-Essen. The author has contributed to research in topics: Photonic crystal & Antenna (radio). The author has an hindex of 32, co-authored 305 publications receiving 3826 citations. Previous affiliations of Daniel Erni include Ruhr University Bochum & Iowa State University.
Papers
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Journal ArticleDOI
Leaky-Wave Antennas Based on Noncutoff Substrate Integrated Waveguide Supporting Beam Scanning From Backward to Forward
Yue-Long Lyu,Xiao-Xin Liu,Peng-Yuan Wang,Daniel Erni,Qun Wu,Cong Wang,Nam-Young Kim,Fanyi Meng +7 more
TL;DR: In this paper, the authors proposed an approach to realize substrate integrated waveguide (SIW)-based leaky-wave antennas (LWAs) supporting continuous beam scanning from backward to forward above the cutoff frequency.
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Polarization-Independent Metamaterial Analog of Electromagnetically Induced Transparency for a Refractive-Index-Based Sensor
TL;DR: In this paper, a polarization-independent metamaterial analog of electromagnetically induced transparency (EIT) at microwave frequencies for normal incidence and linearly polarized waves is experimentally and numerically demonstrated.
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A very short planar silica spot-size converter using a nonperiodic segmented waveguide
TL;DR: In this article, a planar silica spot-size converter for a wavelength of 1.55 /spl mu/m is implemented in the form of a nonperiodic segmented waveguide structure with irregular tapering.
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Multiple multipole method with automatic multipole setting applied to the simulation of surface plasmons in metallic nanostructures
TL;DR: It is shown that the multiple multipole (MMP) method, together with an automatic multipole setting (AMS) procedure, is well suited for these computations of surface plasmons in metallic nanostructures with various geometries.
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A low-power 20-GHz 52-dB/spl Omega/ transimpedance amplifier in 80-nm CMOS
TL;DR: In this article, a transimpedance amplifier (TIA) for a low-power, short-distance, high-density fiber-optic interconnect communication system is described.