Japanese journal of applied physics : JJAP online.

In this paper, a new Si/SiGe heterojunction tunneling field-effect transistor with a T-shaped gate (HTG-TFET) is proposed and investigated by Silvaco-Atlas simulation. The two source regions of the HTG-TFET are placed on both sides of the gate to increase the tunneling area. The T-shaped gate is designed to overlap with N+ pockets in both the lateral and vertical directions, which increases the electric field and tunneling rate at the top of tunneling junctions. Moreover, using SiGe in the pocket regions leads to the smaller tunneling distance. Therefore, the proposed HTG-TFET can obtain the higher on-state current. The simulation results show that on-state current of HTG-TFET is increased by one order of magnitude compared with that of the silicon-based counterparts. The average subthreshold swing (SS) of HTG-TFET is 44.64 mV/dec when V
 g is varied from 0.1 to 0.4 V, and the point SS is 36.59 mV/dec at V
 g = 0.2 V. Besides, this design cannot bring the sever Miller capacitance for the TFET circuit design. By using the T-shaped gate and SiGe pocket regions, the overall performance of the TFET is optimized.

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Design of High Performance Si/SiGe Heterojunction Tunneling FETs with a T-Shaped Gate

Cathodoluminescence technique combined with transmission electron microscopy (TEM-CL) has been used to characterize optical properties of dislocations in GaN epilayers. The dislocations act as nonradiative centers with different recombination rates. TEM-CL observation showed that even for the same Burgers vector of a, the dislocations show different electrical activity depending on the direction of dislocation line, i.e., the edge-type dislocation parallel to the c plane is very active, while the screw-type one is less active. The simulation of the CL images gives us the information of parameters such as carrier lifetime and diffusion length. (C) 2003 American Institute of Physics.

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Cathodoluminescence characterization of dislocations in gallium nitride using a transmission electron microscope - eScholarship

Channel-stacked 3D NAND flash memory is very promising candidate for the next-generation NAND flash memory. However, there is an inherent issue on cell size variation between stacked channels due to the declined etch slope. In this paper, the effect of the cell variation on the incremental step pulse programming (ISPP) characteristics is studied with 3D TCAD simulation. The ISPP slope degradation of elliptical channel is investigated. To solve that problem, a new programming method is proposed, and we can alleviate the VT variation among cells and reduce the total programming time.

A New Programming Method to Alleviate the Program Speed Variation in Three-Dimensional Stacked Array NAND Flash Memory

Optimization of L-shaped tunneling field-effect transistor for ambipolar current suppression and Analog/RF performance enhancement

In order to verify the effects of localized body doping (LBD) on alternating current switching performances of tunnel FETs (TFETs) with vertical structures, The TFET inverter composed of n-/p-type TFET with the localized p+/n+ body doping is simulated with the help of mixed-mode device and circuit simulations. As a result, falling/rising delay is significantly improved due to the locally high channel-to-drain side energy barrier induced by the LBD. Furthermore, LBD conditions, such as doping concentration, depth, and width, are optimized to maximize the improvement of falling/rising delay. Based on the optimization results, it is found that enough wide doping width and deep depth are inevitable to minimize the drain voltage ( ${V} _{D}$ )-induced lowering of the locally increased barrier and the increase of ambipolar current and too wide doping width cannot be applied due to the ON-current reduction caused by the degraded controllability of gate voltage on channel similarly to short channel effects. Moreover, the doping width and depth should be adjusted according to LBD concentration.

Effects of Localized Body Doping on Switching Characteristics of Tunnel FET Inverters With Vertical Structures

In order to overcome small current drivability of a tunneling field-effect transistor (TFET), a TFET using Schottky barrier (SBTFET) is proposed. The proposed device has a metal source region unlike the conventional TFET. In addition, dopant segregation technology between the source and channel region is applied to reduce tunneling resistance. For TFET fabrication, spacer technique is adopted to enable self-aligned process because the SBTFET consists of source and drain with different types. Also the control device which has a doped source region is made to compare the electrical characteristics with those of the SBTFET. From the measured results, the SBTFET shows better on/off switching property than the control device. The observed drive current is larger than those of the previously reported TFET. Also, short-channel effects (SCEs) are investigated through the comparison of electrical characteristics between the long- and shortchannel SBTFET .

Schottky Barrier Tunnel Field-Effect Transistor using Spacer Technique

In order to overcome the small current drivability of a tunneling field-effect transistor (TFET), we have introduced a TFET with the SiGe body and elevated Si drain region. The proposed TFET features large on-current and lower subthreshold swing (SS) compared with the Si TFET. Also, by using elevated Si drain region, it is expected that ambipolar current can be suppressed. Through the technology computer aided design (TCAD) simulation, the characteristics of the proposed TFET have been investigated to confirm its superiority in performance. The proposed TFET structure enables self-aligned doping process and has a strong immunity to short-channel effects compared with the conventional TFET. In addition, we have confirmed that both n- and p-channel characteristics can be simultaneously improved by using the proposed TFET.

http://iopscience.iop.org/article/10.7567/JJAP.53.06JE12/pdf

Tunneling field-effect transistor with Si/SiGe material for high current drivability

In order to improve the internal quantum efficiency of GaN-based LEDs, a LED structure featuring a p-type trench in the multi-quantum well (MQW) is proposed. This structure has effects on spreading holes into the MQW and reducing the quantum-confined stark effect (QCSE). In addition, two simple fabrication methods using electron-beam (e-beam) lithography or selective wet etching for manufacturing the p-type structure are also proposed. From the measurement results of the manufactured GaN-based LEDs, it is confirmed that the proposed structure using e-beam lithography or selective wet etching shows improved light output power compared to the conventional structure because of more uniform hole distribution. It is also confirmed that the proposed structure formed by e-beam lithography has a significant effect on strain relaxation and reduction in the QCSE from the electro-luminescence measurement.

GaN-based light emitting diodes using p-type trench structure for improving internal quantum efficiency

In this paper, the total drain current (I D) of a tunnel FET (TFET) is decomposed into each current component with different origins to analyze the I D formation mechanisms of the TFET as a function of gate voltage (V GS). Transfer characteristics are firstly extracted with fabricated Silicon channel TFETs (Si TFETs) and silicon germanium channel TFETs (SiGe TFETs) at various temperatures. The subthreshold swings (SS) of both Si TFETs and SiGe TFETs get degraded and the SSs of SiGe TFETs get degraded more as temperature becomes higher. Then, all the I Ds measured at various temperatures are decomposed into each current component through technology computer aided design (TCAD) simulations with a good agreement with experimental data. As a result, it is revealed that Shockley–Read–Hall (SRH) recombination mainly contribute to the I D of a TFET before band to band tunneling (BTBT) occurs. Furthermore, the SS degradation by high temperature is explained successfully by the SRH recombination with electric field dependence.

https://iopscience.iop.org/article/10.7567/JJAP.55.06GG03/pdf

Euyhwan Park

Papers

Effects of Localized Body Doping on Switching Characteristics of Tunnel FET Inverters With Vertical Structures

Schottky Barrier Tunnel Field-Effect Transistor using Spacer Technique

Tunneling field-effect transistor with Si/SiGe material for high current drivability

GaN-based light emitting diodes using p-type trench structure for improving internal quantum efficiency

Analysis on temperature dependent current mechanism of tunnel field-effect transistors