J
Jamil A. Wakil
Researcher at IBM
Publications - 34
Citations - 1053
Jamil A. Wakil is an academic researcher from IBM. The author has contributed to research in topics: Chip & Flip chip. The author has an hindex of 13, co-authored 34 publications receiving 1001 citations.
Papers
More filters
Journal ArticleDOI
Hotspot-Limited Microprocessors: Direct Temperature and Power Distribution Measurements
Hendrik F. Hamann,Alan J. Weger,James A. Lacey,Zhigang Hu,Pradip Bose,Erwin B. Cohen,Jamil A. Wakil +6 more
TL;DR: The SIMP method, which is applied to the dual core PowerPC970MP to directly measure the temperature and power fields as a function of workload and frequency, is applied and a pronounced movement of the hotspot location is observed.
Journal ArticleDOI
A Practical Implementation of Silicon Microchannel Coolers for High Power Chips
Evan G. Colgan,Bruce K. Furman,Michael A. Gaynes,W. Graham,Nancy C. LaBianca,John H. Magerlein,Robert J. Polastre,M.B. Rothwell,Raschid J. Bezama,Rehan Choudhary,Kenneth C. Marston,Hilton T. Toy,Jamil A. Wakil,Jeffrey A. Zitz,Roger R. Schmidt +14 more
TL;DR: In this paper, the authors describe a practical implementation of a single-phase Si microchannel cooler designed for cooling very high power chips such as microprocessors, which is able to cool chips with average power densities of 400W/cm2 or more.
Proceedings ArticleDOI
A practical implementation of silicon microchannel coolers for high power chips
Evan G. Colgan,Bruce K. Furman,A. Gaynes,W. Graham,Nancy C. LaBianca,John H. Magerlein,Robert J. Polastre,M.B. Rothwell,Raschid J. Bezama,Rehan Choudhary,Kenneth C. Marston,Hilton T. Toy,Jamil A. Wakil,Jeffrey A. Zitz +13 more
TL;DR: In this article, the authors describe a practical implementation of a single-phase Si microchannel cooler designed for cooling very high power chips such as microprocessors, achieving a unit thermal resistance of 10.5 C-mm/sup 2/W from the cooler surface to the inlet water with a fluid pressure drop of less than 35 kPa.
Journal ArticleDOI
The evolution of build-up package technology and its design challenges
Edmund Blackshear,Moises Cases,E. Klink,S. R. Engle,Ronald S Malfatt,D.N. de Araujo,Stefano S. Oggioni,L. D. LaCroix,Jamil A. Wakil,Gareth G. Hougham,Nam H. Pham,David J. Russell +11 more
TL;DR: The challenges encountered by IBM during the design, manufacture, and reliability testing phases of development of SBU substrates as solutions for application-specific integrated circuit (ASIC) and microprocessor packaging applications are focused on.
Proceedings ArticleDOI
Spatially-resolved imaging of microprocessor power (SIMP): hotspots in microprocessors
TL;DR: In this paper, the authors present the details of a new technique, which allows for spatially-resolved imaging of microprocessor power (SIMP) under full operational conditions.