Lennart Wevers

TL;DR: An overview of the most recent developments and improvements to the low-loss TriPleX Si3N4 waveguide technology is presented in this article, which can be combined to design complex functional circuits, but more important are manufactured in a single monolithic flow to create a compact photonic integrated circuit.

TL;DR: In this article, a hybrid InP to SiN TriPleX integration interface with a novel alignment technique and its application to complex photonic integrated circuits is presented, where vertical alignment stops are used to simplify the alignment process and allow for array integration with the same simplicity as for single dies.

TL;DR: In this paper, the authors demonstrate the first stress-optic modulator in a silicon nitride-based waveguide platform (TriPleX) in the telecommunication C-band.

TL;DR: In this paper, the authors present an interface for hybrid flip-chip integration of InP-based laser sources to silicon-nitride-based photonic platforms, which enables efficient high optical power coupling over a wide temperature range.

TL;DR: In this paper, the authors present two types of analog photonic links (APLs) to achieve true time delay (TTD) beamforming, based on hybrid optical integration of TriPleX and InP chips.