L
Ludvik Martinu
Researcher at École Polytechnique de Montréal
Publications - 314
Citations - 9653
Ludvik Martinu is an academic researcher from École Polytechnique de Montréal. The author has contributed to research in topics: Thin film & Microstructure. The author has an hindex of 48, co-authored 313 publications receiving 8645 citations. Previous affiliations of Ludvik Martinu include Heinrich Hertz Institute & École Polytechnique.
Papers
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Proceedings ArticleDOI
Charge storage in plasma deposited thin films
TL;DR: In this article, the authors describe the production of electrets prepared at ambient temperature in a dual-mode microwave/radiofrequency plasma reactor on single-crystal silicon substrates, which consist of 0.5-1.5 mu m-thick films of plasma silicon dioxide, plasma silicon nitride, plasma polymerized hexamethyldisilazane (pp-HMDSN), or a multilayer structure of these materials.
Book ChapterDOI
Aging Processes in Diamond-Like Carbon and Carbon/Metal Films
TL;DR: In this paper, several aspects of film stability or aging can be considered, such as spontaneous aging, internal material property characterized by the driving force to acquire minimum system energy without any intermediate agent.
Journal ArticleDOI
Ta-C micro-composite material formed by heat treatment of plasma carburized layer
TL;DR: In this article, a Tantalum-carbon micro-composite material (MCM) was produced by a process which combines plasma carburizing and heat treatment, which was performed in inductively coupled radio-frequency plasma, using CH 4 -H 2 -Ar mixtures, followed by a two-step heat treatment which includes solid solution and aging.
Journal ArticleDOI
Tailoring angular selectivity in SiO2 slanted columnar thin films using atomic layer deposition of titanium nitride
Sasha Woodward-Gagné,Nicolas Desjardins-Lecavalier,Bill Baloukas,Oleg Zabeida,Ludvik Martinu +4 more
TL;DR: In this article, angle resolved spectrophotometry characterization revealed angle-dependent transmission of the films, which enabled tailoring of the angular selectivity independently from the SCTF thickness and density.
Proceedings ArticleDOI
Electrical properties of dual-frequency plasma deposited silicon-compound films
TL;DR: In this article, a dual-frequency deposition approach is discussed which consists of a microwave discharge during which an RF-induced negative DC bias voltage V/sub B/ is applied to the substrates.