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Design Of Analog Cmos Integrated Circuits

We demonstrate first room temperature, and ultrabright single photon emission from a color center in two-dimensional multilayer hexagonal boron nitride. Density Functional Theory calculations indicate that vacancy-related centers are a likely source of the emission.

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Quantum emission from hexagonal boron nitride monolayers

Spin dynamics in semiconductors

This article reviews the current status of spin dynamics in semiconductors which has achieved a lot of progress in the past years due to the fast growing field of semiconductor spintronics. The primary focus is the theoretical and experimental developments of spin relaxation and dephasing in both spin precession in time domain and spin diffusion and transport in spacial domain. A fully microscopic many-body investigation on spin dynamics based on the kinetic spin Bloch equation approach is reviewed comprehensively.

First‐principles electronic structure calculations on wurtzite AlN, GaN, and InN reveal crystal‐field splitting parameters ΔCF of −217, 42, and 41 meV, respectively, and spin–orbit splitting parameters Δ0 of 19, 13, and 1 meV, respectively. In the zinc blende structure ΔCF≡0 and Δ0 are 19, 15, and 6 meV, respectively. The unstrained AlN/GaN, GaN/InN, and AlN/InN valence band offsets for the wurtzite (zinc blende) materials are 0.81 (0.84), 0.48 (0.26), and 1.25 (1.04) eV, respectively. The trends in these spectroscopic quantities are discussed and recent experimental findings are analyzed in light of these predictions.

Valence band splittings and band offsets of AlN, GaN and InN.

This letter reports a normally-OFF Al2O3/GaN gate-recessed MOSFET using a low-damage digital recess technique featuring multiple cycles of plasma oxidation and wet oxide removal process. The wet etching process eliminates the damage induced by plasma bombardment induced in conventional inductively coupled plasma dry etching process so that good surface morphology and high interface quality could be achieved. The fully recessed Al2O3/GaN MOSFET delivers true enhancement-mode operation with a threshold voltage of +1.7 V. The maximum output current density is 528 mA/mm at a positive gate bias of 8 V. A peak field-effect mobility of 251 cm2/V·s is obtained, indicating high-quality Al2O3/GaN interface.

High-Performance Normally-Off ${\rm Al}_{2}{\rm O}_{3}/{\rm GaN}$ MOSFET Using a Wet Etching-Based Gate Recess Technique

We report a high-performance normally-off Al
 2
O
 3
/AlN/GaN MOS-channel-high electron mobility transistor (MOSC-HEMT) featuring a monocrystalline AlN interfacial layer inserted between the amorphous Al
 2
O
 3
 gate dielectric and the GaN channel. The AlN interfacial layer effectively blocks oxygen from the GaN surface and prevents the formation of detrimental Ga-O bonds. Frequency-dispersion in C-V characteristics and threshold voltage hysteresis are effectively suppressed, owing to improved interface quality. The new MOSC-HEMTs exhibit a maximum drain current of 660 mA/mm, a field-effect mobility of 165 cm
 2
/V·s, a high on/off drain current ratio of ~10
 10
, and low dynamic on-resistance degradation.

Al 2 O 3 /AlN/GaN MOS-Channel-HEMTs With an AlN Interfacial Layer

Kink effects are studied in conventional AlGaN/GaN high-electron-mobility transistors by measuring their current-voltage characteristics with various bias sweeping conditions at drain and gate terminals. It is found that the kink effect is induced by drain and gate pumping. The magnitude of kink is directly related to the maximum drain voltage and current levels during on-state operation. The hot electrons in the 2-D electron gas channel generated under high drain bias could be injected into the adjacent epitaxial buffer layer where they can be captured by donor-like traps. Hot electron trapping and the subsequent field-assisted de-trapping is suggested to be the dominant mechanism of kink generation in the studied device. The extracted activation energy of the traps accounting for the kink effect is 589 ± 67 meV from temperature-dependent transient measurement, and is close to the energy of the E2 trap widely reported in GaN layers.

Kink Effect in AlGaN/GaN HEMTs Induced by Drain and Gate Pumping

(Al)GaN recess-free normally OFF technology is developed for fabrication of high-yield lateral GaN-based power devices. The recess-free process is achieved by an ultrathin-barrier (UTB) AlGaN/GaN heterostructure that features a natural pinched-off 2-D electron gas channel. The top–down manufacturing technique overcomes the challenges in etching of AlGaN barrier with well-controlled depth and uniformity, which is especially attractive for fabrication of normally OFF GaN-based high-electron-mobility transistors (HEMTs) and metal–insulator–semiconductor HEMTs (MIS-HEMTs) on large-size Si substrate. With SiNx passivation grown by low-pressure chemical-vapor deposition, on-resistance of the UTB-AlGaN/GaN-based power devices can be significantly reduced. High-uniformity low-hysteresis normally OFF HEMTs and Al2O3/AlGaN/GaN MIS-HEMTs are successfully demonstrated on the UTB AlGaN/GaN-on-Si platform. It is also a compelling technology platform for manufacturing high-performance GaN-based lateral power diodes, and normally OFF p-(Al)GaN heterojunction field-effect transistors.

Ultrathin-Barrier AlGaN/GaN Heterostructure: A Recess-Free Technology for Manufacturing High-Performance GaN-on-Si Power Devices

We report a high-performance normally-off Al2O3/AlN/GaN MOS-channel-high electron mobility transistor (MOSC-HEMT) featuring a monocrystalline AlN interfacial layer inserted between the amorphous Al2O3 gate dielectric and the GaN channel. The AlN interfacial layer effectively blocks oxygen from the GaN surface and prevents the formation of detrimental Ga-O bonds. Frequency-dispersion in C-V characteristics and threshold voltage hysteresis are effectively suppressed, owing to improved interface quality. The new MOSC-HEMTs exhibit a maximum drain current of 660 mA/mm, a field-effect mobility of 165 cm2/V·s, a high on/off drain current ratio of ~1010, and low dynamic on-resistance degradation.

Maojun Wang

Papers

High-Performance Normally-Off ${\rm Al}_{2}{\rm O}_{3}/{\rm GaN}$ MOSFET Using a Wet Etching-Based Gate Recess Technique

Al 2 O 3 /AlN/GaN MOS-Channel-HEMTs With an AlN Interfacial Layer

Kink Effect in AlGaN/GaN HEMTs Induced by Drain and Gate Pumping

Ultrathin-Barrier AlGaN/GaN Heterostructure: A Recess-Free Technology for Manufacturing High-Performance GaN-on-Si Power Devices

Interface Characterization of Normally-Off Al2O3/AlN/GaN MOS-Channel-HEMTs with an AlN Interfacial Layer