Since the successful demonstration of a blue light-emitting diode (LED)1, potential materials for making short-wavelength LEDs and diode lasers have been attracting increasing interest as the demands for display, illumination and information storage grow2,3,4. Zinc oxide has substantial advantages including large exciton binding energy, as demonstrated by efficient excitonic lasing on optical excitation5,6. Several groups have postulated the use of p-type ZnO doped with nitrogen, arsenic or phosphorus7,8,9,10, and even p–n junctions11,12,13. However, the choice of dopant and growth technique remains controversial and the reliability of p-type ZnO is still under debate14. If ZnO is ever to produce long-lasting and robust devices, the quality of epitaxial layers has to be improved as has been the protocol in other compound semiconductors15. Here we report high-quality undoped films with electron mobility exceeding that in the bulk. We have used a new technique to fabricate p-type ZnO reproducibly. Violet electroluminescence from homostructural p–i–n junctions is demonstrated at room-temperature.

Repeated temperature modulation epitaxy for p-type doping and light-emitting diode based on ZnO

Since 1993, InGaN light-emitting diodes (LEDs) have been improved and commercialized, but these devices have not fulfilled their original promise as solid-state replacements for light bulbs as their light-emission efficiencies have been limited. Here we describe a method to enhance this efficiency through the energy transfer between quantum wells (QWs) and surface plasmons (SPs). SPs can increase the density of states and the spontaneous emission rate in the semiconductor, and lead to the enhancement of light emission by SP–QW coupling. Large enhancements of the internal quantum efficiencies (etaint) were measured when silver or aluminium layers were deposited 10 nm above an InGaN light-emitting layer, whereas no such enhancements were obtained from gold-coated samples. Our results indicate that the use of SPs would lead to a new class of very bright LEDs, and highly efficient solid-state light sources.

/pdf/surface-plasmon-enhanced-light-emitters-based-on-ingan-4ithz2fei5.pdf

Surface-Plasmon-Enhanced Light Emitters Based on InGaN Quantum Wells

In this review, the structural, mechanical, thermal, and chemical properties of substrates used for gallium nitride (GaN) epitaxy are compiled, and the properties of GaN films deposited on these substrates are reviewed. Among semiconductors, GaN is unique; most of its applications uses thin GaN films deposited on foreign substrates (materials other than GaN); that is, heteroepitaxial thin films. As a consequence of heteroepitaxy, the quality of the GaN films is very dependent on the properties of the substrate—both the inherent properties such as lattice constants and thermal expansion coefficients, and process induced properties such as surface roughness, step height and terrace width, and wetting behavior. The consequences of heteroepitaxy are discussed, including the crystallographic orientation and polarity, surface morphology, and inherent and thermally induced stress in the GaN films. Defects such as threading dislocations, inversion domains, and the unintentional incorporation of impurities into the epitaxial GaN layer resulting from heteroepitaxy are presented along with their effect on device processing and performance. A summary of the structure and lattice constants for many semiconductors, metals, metal nitrides, and oxides used or considered for GaN epitaxy is presented. The properties, synthesis, advantages and disadvantages of the six most commonly employed substrates (sapphire, 6H-SiC, Si, GaAs, LiGaO 2 , and AlN) are presented. Useful substrate properties such as lattice constants, defect densities, elastic moduli, thermal expansion coefficients, thermal conductivities, etching characteristics, and reactivities under deposition conditions are presented. Efforts to reduce the defect densities and to optimize the electrical and optical properties of the GaN epitaxial film by substrate etching, nitridation, and slight misorientation from the (0 0 0 1) crystal plane are reviewed. The requirements, the obstacles, and the results to date to produce zincblende GaN on 3C-SiC/Si(0 0 1) and GaAs are discussed. Tables summarizing measures of the GaN quality such as XRD rocking curve FWHM, photoluminescence peak position and FWHM, and electron mobilities for GaN epitaxial layers produced by MOCVD, MBE, and HVPE for each substrate are given. The initial results using GaN substrates, prepared as bulk crystals and as free-standing epitaxial films, are reviewed. Finally, the promise and the directions of research on new potential substrates, such as compliant and porous substrates are described.

Substrates for gallium nitride epitaxy

The wet etching of GaN, AlN, and SiC is reviewed including conventional etching in aqueous solutions, electrochemical etching in electrolytes and defect-selective chemical etching in molten salts. The mechanism of each etching process is discussed. Etching parameters leading to highly anisotropic etching, dopant-type/bandgap selective etching, defect-selective etching, as well as isotropic etching are discussed. The etch pit shapes and their origins are discussed. The applications of wet etching techniques to characterize crystal polarity and defect density/distribution are reviewed. Additional applications of wet etching for device fabrication, such as producing crystallographic etch profiles, are also reviewed.

Wet etching of GaN, AlN, and SiC : a review

Ultraviolet (UV) photodetectors have drawn extensive attention owing to their applications in industrial, environmental and even biological fields. Compared to UV-enhanced Si photodetectors, a new generation of wide bandgap semiconductors, such as (Al, In) GaN, diamond, and SiC, have the advantages of high responsivity, high thermal stability, robust radiation hardness and high response speed. On the other hand, one-dimensional (1D) nanostructure semiconductors with a wide bandgap, such as β-Ga2O3, GaN, ZnO, or other metal-oxide nanostructures, also show their potential for high-efficiency UV photodetection. In some cases such as flame detection, high-temperature thermally stable detectors with high performance are required. This article provides a comprehensive review on the state-of-the-art research activities in the UV photodetection field, including not only semiconductor thin films, but also 1D nanostructured materials, which are attracting more and more attention in the detection field. A special focus is given on the thermal stability of the developed devices, which is one of the key characteristics for the real applications.

A Comprehensive Review of Semiconductor Ultraviolet Photodetectors: From Thin Film to One-Dimensional Nanostructures

Etching characteristics of nondoped GaN films with the polar surface in KOH solution have been investigated. It is confirmed that the continuous etching in KOH solution takes place only for the GaN films with N-face (−c) polarity independent of the deposition method and growth condition. It is found by x-ray photoelectron spectroscopy (XPS) analysis for the Ga face (+c) and N-face (−c) GaN films that the atomic composition of the +c surface is not changed before and after dipping in KOH solution and that on the other hand, the amount of oxygen (oxide) on the −c surface is significantly decreased by the etching. It is also found that the band bending increases by −0.4±0.2 and 0.6±0.2 eV for the +c and −c surfaces after etching, respectively. This is discussed in terms of the surface chemistry. Based on the XPS result, the selective etching of the GaN polar surface is pointed out to originate from bonding configuration of nitrogen at the surface.

Selective etching of GaN polar surface in potassium hydroxide solution studied by x-ray photoelectron spectroscopy

Single-crystalline hexagonal GaN (α-GaN) films have been grown on (0001) sapphire substrates by metalorganic chemical vapor deposition at 1040 °C. The complex dielectric functions, e(E)=e1(E)+ie2(E), of the epitaxial films have been measured by spectroscopic ellipsometry (SE) for E⊥c in the region between 1.5 and 5.0 eV at room temperature. Previously published ultraviolet SE spectra of α-GaN are examined by considering the effects of surface roughness using an analysis based on an effective medium model. Ex situ atomic force microscopy is used to assess independently surface flatness. By mathematically removing the effects of surface roughness, the most reliable e(E) values for α-GaN are presented in the 1.25–10 eV photon–energy range. Theoretical dispersion analysis suggests that the E0 structure could be characterized by a three-dimensional M0 critical point and the E1α (α=A,B,C) structures by two-dimensional M1 critical points. To facilitate design of various optoelectronic devices, dielectric-functio...

Optical properties of hexagonal GaN

We have investigated the dependence of impurity incorporation on the polar direction of GaN growth by using secondary ion mass spectroscopy (SIMS). GaN films were deposited under conditions used for growing device-quality materials on sapphire substrates while controlling their polar direction. It was found that the polarity of the GaN film influences the incorporation of impurities. SIMS analysis has revealed that the impurities related to carbon, oxygen, and aluminum are more readily incorporated into N-face GaN films.

Dependence of impurity incorporation on the polar direction of GaN film growth

The dependence of polar direction of GaN film on growth conditions has been investigated by changing either the group-V/group-III ratio (V/III ratio) in supplying the source gas or the deposition rate. GaN films were deposited on a nitrided sapphire by two-step metalorganic chemical vapor deposition. The surface morphology changed from flat hexagonal to pyramidal hexagonal facet with the increase of V/III ratio. However, the polar direction of GaN on an optimized buffer layer of 20 nm thickness was N-face (−c) polarity, independent of both the V/III ratio and the deposition rate. The polarity of the GaN epitaxtial layer can be determined by that of an interface (nitrided sapphire, annealed buffer layer or GaN substrate) at the deposition of GaN epitaxial layer. The higher V/III ratio enhanced the nucleation density, and reduced the size of hexagonal facets. The nuclei, forming the favorable hexagonal facets of wurtzite GaN, should grow laterally along the {1010} directions to cover a room among the facet...

/pdf/growth-mode-and-surface-morphology-of-a-gan-film-deposited-1vbs6xpcws.pdf

Shunro Fuke

Papers

Selective etching of GaN polar surface in potassium hydroxide solution studied by x-ray photoelectron spectroscopy

Optical properties of hexagonal GaN

Dependence of impurity incorporation on the polar direction of GaN film growth

Growth mode and surface morphology of a GaN film deposited along the N-face polar direction on c-plane sapphire substrate

Donor–acceptor pair luminescence in nitrogen-doped ZnO films grown on lattice-matched ScAlMgO4 (0001) substrates