Journal ArticleDOI
Physics-Based Via and Trace Models for Efficient Link Simulation on Multilayer Structures Up to 40 GHz
Renato Rimolo-Donadio,Xiaoxiong Gu,Young H. Kwark,Mark B. Ritter,Bruce Archambeault,F. de Paulis,Yaojiang Zhang,Jun Fan,Heinz-Dietrich Bruns,Christian Schuster +9 more
TLDR
In this paper, an analytical model for vias and traces is presented for simulation of multilayer interconnects at the package and printed circuit board levels, which can be applied to efficiently simulate a wide range of structures.Abstract:
Analytical models for vias and traces are presented for simulation of multilayer interconnects at the package and printed circuit board levels. Vias are modeled using an analytical formulation for the parallel-plate impedance and capacitive elements, whereas the trace-via transitions are described by modal decomposition. It is shown that the models can be applied to efficiently simulate a wide range of structures. Different scenarios are analyzed including thru-hole and buried vias, power vias, and coupled traces routed into different layers. By virtue of the modal decomposition, the proposed method is general enough to handle structures with mixed reference planes. For the first time, these models have been validated against full-wave methods and measurements up to 40 GHz. An improvement on the computation speed of at least two orders of magnitude has been observed with respect to full-wave simulations.read more
Citations
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Journal ArticleDOI
Signal Integrity Design for High-Speed Digital Circuits: Progress and Directions
TL;DR: This paper reviews recent progress and future directions of signal integrity design for high-speed digital circuits, focusing on four areas: signal propagation on transmission lines, discontinuity modeling and characterization, measurement techniques, and link-path design and analysis.
Journal ArticleDOI
Overview of Signal Integrity and EMC Design Technologies on PCB: Fundamentals and Latest Progress
TL;DR: The fundamentals and latest progress of modeling, analysis, and design technologies for signal integrity and electromagnetic compatibility on PCB and package in the past decades are reviewed and the necessity of practical training of designers is mentioned.
Journal ArticleDOI
Signal/Power Integrity Analysis for Multilayer Printed Circuit Boards Using Cascaded S-Parameters
TL;DR: In this article, a cascaded S-parameter method is proposed for signal/power integrity analysis of multiple vias in a multilayer printed circuit board (PCB), which enables efficient and accurate construction and simulation of physics-based via model for complex multi-layer PCB structures involving vias.
Journal ArticleDOI
Circular Ports in Parallel-Plate Waveguide Analysis With Isotropic Excitations
TL;DR: In this article, an exact and consistent modeling of circularly shaped ports in the power/ground plane analysis under the assumption of isotropic excitations is addressed, where the analytical solutions for infinite planes are combined with the contour integral method to model finite-sized power planes.
References
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Book
Analysis of Multiconductor Transmission Lines
TL;DR: Analysis of Multiconductor Transmission Lines, Second Edition has been significantly updated and reorganized to fill the need for a structured course on transmission lines in a senior undergraduate- or graduate-level electrical engineering program.
Proceedings ArticleDOI
Analysis of Multiconductor Transmission Lines
T. B. Arabi,T. K. Sarkar +1 more
TL;DR: In this paper, the authors outline a methodology for the computation of the response of a multiconductor transmission line terminated by linear networks, where the lines are embedded in a multilayered lossy dielectric media and have arbitrary cross sections, but uniform along the length.
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Transmission Line Design Handbook
TL;DR: In this paper, the authors present a comprehensive overview of transmission line components and discontinuities, including coupled lines, capacitors, and resistors, as well as a glossary of special functions.
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Feature selective validation (FSV) for validation of computational electromagnetics (CEM). part I-the FSV method
Alistair Duffy,A.J.M. Martin,Antonio Orlandi,Giulio Antonini,Trevor M. Benson,Malcolm Woolfson +5 more
TL;DR: A detailed analysis of the FSV method is presented, setting it firmly in the context of previous comparison techniques; it suggests the relationship between validation of graphically presented data and the psychology of visual perception, and a set of applicability tests to judge the effectiveness of computer-based CEM validation techniques.
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