ASRC Aerospace Corporation

About: ASRC Aerospace Corporation is a based out in . It is known for research contribution in the topics: In situ resource utilization & Propulsion. The organization has 194 authors who have published 404 publications receiving 4748 citations.

Characterization of Low Noise, Precision Voltage Reference REF5025-HT Under Extreme Temperatures

Abstract: The performance of Texas Instruments precision voltage reference REF5025-HT was assessed under extreme temperatures. This low noise, 2.5 V output chip is suitable for use in high temperature down-hole drilling applications, but no data existed on its performance at cryogenic temperatures. The device was characterized in terms of output voltage and supply current at different input voltage levels as a function of temperature between +210 C and -190 C. Line and load regulation characteristics were also established at six load levels and at different temperatures. Restart capability at extreme temperatures and the effects of thermal cycling, covering the test temperature range, on its operation and stability were also investigated. Under no load condition, the voltage reference chip exhibited good stability in its output over the temperature range of -50 C to +200 C. Outside that temperature range, output voltage did change as temperature was changed. For example, at the extreme temperatures of +210 C and - 190 C, the output level dropped to 2.43 V and 2.32 V, respectively as compared to the nominal value of 2.5 V. At cryogenic test temperatures of -100 C and -150 C the output voltage dropped by about 20%. The quiescent supply current of the voltage reference varied slightly with temperature but remained close to its specified value. In terms of line regulation, the device exhibited excellent stability between -50 C and +150 C over the entire input voltage range and load levels. At the other test temperatures, however, while line regulation became poor at cryogenic temperatures of -100 C and below, it suffered slight degradation at the extreme high temperature but only at the high load level of 10 mA. The voltage reference also exhibited very good load regulation with temperature down to -100 C, but its output dropped sharply at +210 C only at the heavy load of 10 mA. The semiconductor chip was able restart at the extreme temperatures of -190 C and +210 C, and the limited thermal cycling did not influence its characteristics and had no impact on its packaging as no structural or physical damage was observed.

Strategies to Maximize Science Data Availability for the GOES-R Series of Satellites

Abstract: The Geostationary Operational Environmental Satellite-R Series (GOES-R) is the next generation of Untied States geostationary weather satellites. The GOES-R series significantly improves the detection and observation of environmental phenomena that directly affect public safety, protection of property and the economic health and prosperity of the United States and all countries within the western hemisphere. Given the real-time or ''now-casting'' nature of the GOES science gathering mission, any data outage or interruption can reduce warning times or scientific fidelity for critical weather data. GOES-R mission level requirements limit key performance product outages to a total of six hours per year to maximize science data availability. Lower level requirement only allow for 120 minutes of disruption between the spacecraft bus interface to the instruments. This requirement is met using both design features of the satellite and ground system, in addition to operational strategies.

Development of a Temperature Sensor for Jet Engine and Space Mission Applications

Abstract: Electronics for Distributed Turbine Engine Control and Space Exploration Missions are expected to encounter extreme temperatures and wide thermal swings. In particular, circuits deployed in a jet engine compartment are likely to be exposed to temperatures well exceeding 150 C. To meet this requirement, efforts exist at the NASA Glenn Research Center (GRC), in support of the Fundamental Aeronautics Program/Subsonic Fixed Wing Project, to develop temperature sensors geared for use in high temperature environments. The sensor and associated circuitry need to be located in the engine compartment under distributed control architecture to simplify system design, improve reliability, and ease signal multiplexing. Several circuits were designed using commercial-off-the-shelf as well as newly-developed components to perform temperature sensing at high temperatures. The temperature-sensing circuits will be described along with the results pertaining to their performance under extreme temperature.

Silicon-on-insulator (SOI) devices and mixed-signal circuits for extreme temperature applications

Abstract: Electronic systems in planetary exploration missions and in aerospace applications are expected to encounter extreme temperatures and wide thermal swings in their operational environments. Electronics designed for such applications must, therefore, be able to withstand exposure to extreme temperatures and to perform properly for the duration of the missions. Electronic parts based on silicon-on-insulator (SOI) technology are known, based on device structure, to provide faster switching, consume less power, and offer better radiation-tolerance compared to their silicon counterparts. They also exhibit reduced current leakage and are often tailored for high temperature operation. However, little is known about their performance at low temperature. The performance of several SOI devices and mixed-signal circuits was determined under extreme temperatures, cold-restart, and thermal cycling. The investigations were carried out to establish a baseline on the functionality and to determine suitability of these devices for use in space exploration missions under extreme temperatures. The experimental results obtained on selected SOI devices are presented and discussed in this paper.

Operation of a Giant Magnetoresistive (GMR) Digital Isolator, Type IL510, Under Extreme Temperatures

Abstract: A relatively new type of signal isolation based on Giant Magnetoresistive (GMR) technology was investigated for potential use in harsh temperature environments. Operational characteristics of the 2Mbps single channel, IL510-Series commercial-off-the-shelf (COTS) digital isolator chip was obtained under extreme temperature exposure and thermal cycling in the range of -190 C to +120 C. The isolator was evaluated in terms of its output signal delivery and stability, output rise (t(sub r)) and fall times (t(sub f)), and propagation delays at 50% level between input and output during low to high (t(sub PLH)) and high to low (t(sub PHL)) transitions. The device performed very well throughout the entire test temperature range as no significant changes occurred either in its function or in its output signal timing characteristics. The limited thermal cycling, which comprised of 12 cycles between -190 C and +120 C, also had no influence on its performance. In addition, the device packaging underwent no structural damage due to the extreme temperature exposure. These preliminary results indicate that this semiconductor chip has the potential for use in a temperature range that extends beyond its specified regime. Additional and more comprehensive testing, however, is required to establish its operation and reliability and to determine its suitability for long-term use in space exploration missions.