Journal ArticleDOI
A combined silicon fusion and glass/silicon anodic bonding process for a uniaxial capacitive accelerometer
TLDR
In this paper, a high performance acceleration sensor concept is presented, which combines multiple wafer bonding and differential capacitance measurement into a point-symmetrical design, and the accelerometer is a four-layer glass/Si/Si-glass structure realized with a combination of Si/Si fusion bonding and Si/glass anodic bonding.Abstract:
A high performance acceleration sensor concept is presented, which combines multiple wafer bonding and differential capacitance measurement into a point-symmetrical design. The accelerometer is a four-layer glass/Si/Si/glass structure realized with a combination of Si/Si fusion bonding and Si/glass anodic bonding. Fusion bonding with wafer-to-wafer alignment is performed on preprocessed silicon. Glass covers are bonded onto both wafer sides in a single anodic bonding sequence with polarity reversal. The main device characteristics are an exclusive response to a translational acceleration component in a single axis and maximized sensitivity for a given chip area. Modifiable damping characteristics and hence adjustable bandwidth is an additional device feature. This is obtained by controlling the gas pressure and composition during anodic bonding of the glass covers.read more
Citations
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Journal ArticleDOI
SU-8 Optical Accelerometers
TL;DR: In this paper, the SU-8 quad beam optical accelerometers based on intensity modulation were optimized and characterized to achieve a reproducible experimental sensitivity of at least 13.1 dB/g.
Patent
Fuel cell electrode pair assemblies and related methods
TL;DR: In this article, a fuel cell electrode pair assembly with an anode structure derived from a first silicon substrate and an opposing cathode structure from a second silicon substrate is presented, where the anode and the cathode structures have interfacing surfaces that are bonded together with an optional interposing binding material and with at least one selectively positioned bond to thereby form a hermetic seal.
Journal ArticleDOI
BESOI-based integrated optical silicon accelerometer
José Antonio Plaza,Andreu Llobera,Carlos Domínguez,Jaume Esteve,Iñigo Salinas,J. Garcia,J. Berganzo +6 more
TL;DR: In this article, the design, simulation, fabrication and characterization of a new integrated optical accelerometer is presented, where the reduction of fabrication, packaging and thermomechanical stresses are considered by keeping the weak mechanical parts free of stresses.
Journal ArticleDOI
Optical fiber accelerometer based on a silicon micromachined cantilever.
TL;DR: An intensity-modulated fiber-optic accelerometer based on backreflection effects has been manufactured and tested and is devoted to a wavelength-division multiplexing network.
Journal ArticleDOI
Fibre-optic accelerometer using silicon micromachining techniques
TL;DR: In this paper, the movement of a micromachined siliconn cantilever beam is measured in relation to the vibration amplitude, which yields measurements completely independent from all losses and drifts that might occur in the optical chain.
References
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Journal ArticleDOI
Field Assisted Glass‐Metal Sealing
TL;DR: In this paper, a new process is described which permits the sealing of metals to glass and other insulators at temperatures well below the softening point of the glass, by applying a dc voltage in excess of a few hundred volts between the glass and the metal in such a way that the former is at a negative potential with respect to the latter.
Journal ArticleDOI
Silicon‐to‐silicon direct bonding method
TL;DR: In this paper, it was found that strong bonding takes place when a pair of clean, mirror-polished silicon surfaces are contacted at room temperature after hydrophilic surface formation.
Journal ArticleDOI
Accelerometer systems with self-testable features
TL;DR: In this paper, a self-testing technique for a piezoresistive accelerometer is proposed, which allows the device to be tested by electrostatic deflection of the mass.
Journal ArticleDOI
A capacitive pressure sensor with low impedance output and active suppression of parasitic effects
TL;DR: In this paper, the authors describe the design, operating principles and performance of a capacitive pressure sensor in silicon, combined with a dedicated CMOS interface circuit, which is designed to suppress parasitics and to yield an output signal proportional to pressure.
Journal ArticleDOI
Capacitive silicon accelerometer with highly symmetrical design
TL;DR: In this paper, the design and performance of a capacitive micromechanical accelerometer, as well as an electronic circuit for the conditioning of the output signal are described, which consists of a differential capacitance which is formed by a seismic silicon mass and two counter electrodes situated on anodically bonded glass plates.