Journal ArticleDOI
A powerful way of cooling computer chip using liquid metal with low melting point as the cooling fluid
TLDR
In this article, the authors investigated a novel method to significantly lower the chip temperature by using liquid metal with low melting point as the cooling fluid, and the results indicated that the temperature of the computer chip can be significantly reduced with the increasing flow rate of liquid gallium, which suggests that an even higher power dissipation density can be achieved with a large flow of liquid metal and large area of heat dissipation.Abstract:
With the improvement of computational speed, thermal management becomes a serious concern in
computer system. CPU chips are squeezing into tighter and tighter spaces with no more room for heat to
escape. Total power-dissipation levels now reside about 110 W, and peak power densities are reaching
400–500 W/mm2 and are still steadily climbing. As a result,
higher performance and greater reliability are extremely tough to attain. But since the standard conduction
and forced-air convection techniques no longer be able to provide adequate cooling for sophisticated electronic
systems, new solutions are being looked into liquid cooling, thermoelectric cooling, heat pipes, and vapor
chambers. In this paper, we investigated a novel method to significantly lower the chip temperature
using liquid metal with low melting point as the cooling fluid. The liquid gallium was particularly adopted
to test the feasibility of this cooling approach, due to its low melting point at 29.7 °C, high
thermal conductivity and heat capacity. A series of experiments with different flow rates and heat
dissipation rates were performed. The cooling capacity and reliability of the liquid metal were compared
with that of the water-cooling and very attractive results were obtained. Finally, a general criterion
was introduced to evaluate the cooling performance difference between the liquid metal cooling and the water-cooling.
The results indicate that the temperature of the computer chip can be significantly reduced with the increasing
flow rate of liquid gallium, which suggests that an even higher power dissipation density can be achieved
with a large flow of liquid gallium and large area of heat dissipation. The concept discussed in this
paper is expected to provide a powerful cooling strategy for the notebook PC, desktop PC and large
computer. It can also be extended to more wide area involved with thermal management on high heat generation
rate.read more
Citations
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Journal ArticleDOI
Liquid Metal Composites
TL;DR: In this article, the fundamental progress in liquid metal composites is summarized and reviewed in three categories: LM composites with core-shell structure, LM-polymer composites, and LM-particle composites.
Journal ArticleDOI
Thermal management of Li-ion battery with liquid metal
TL;DR: In this paper, a new kind of coolant, liquid metal, is proposed to be used for the thermal management of the battery pack, and mathematical analysis and numerical simulations are conducted to evaluate the cooling capability, pump power consumption and module temperature uniformity of the liquid metal cooling system.
Journal ArticleDOI
Liquid metal cooling in thermal management of computer chips
MA Kunquan,Liu Jing +1 more
TL;DR: In this article, the authors present an overall review on chip cooling using liquid metals or their alloys as coolant, and some new advancement in making a liquid metal cooling device will be discussed.
Journal ArticleDOI
A review of novel thermal management systems for batteries
Journal ArticleDOI
On the convective thermal performance of a CPU cooler working with liquid gallium and CuO/water nanofluid: A comparative study
TL;DR: In this article, the authors investigate the thermal performance of a cooling liquid block working with gallium, CuO/water nanofluid and water and show that gallium is the most efficient coolant amongst the nanofluid and water in terms of convective thermal performance.
References
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Journal ArticleDOI
Thermoelectric Cooling and Power Generation
TL;DR: Improved materials would not only help to cool advanced electronics but could also provide energy benefits in refrigeration and when using waste heat to generate electrical power.
Proceedings ArticleDOI
Application of thermoelectric cooling to electronic equipment: a review and analysis
R.E. Simons,R.C. Chu +1 more
TL;DR: A review of thermoelectric cooling and its application to the cooling of electronic equipment is provided in this article, with a background discussion of early history, current developments, and the defining temperature-pumping equations.
Journal ArticleDOI
Liquid Gallium: Potential Uses as a Heat-Transfer Agent
TL;DR: In this paper, the potential uses of gallium, as well as the most important gallium-based alloys, as energy carriers in high-safety nuclear power plants are discussed.
Proceedings ArticleDOI
The use of heat pipes in personal computers
TL;DR: In this article, the authors reviewed heat pipe applications in notebook computers and high-end systems and summarized the future outlook of heat pipes for cooling of personal computers, including notebooks, desktops, workstations and servers.
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