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A review on the importance of surface coating of micro/nano-mold in micro/nano-molding processes

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TLDR
In this paper, the physical, mechanical and tribological properties of various surface coatings and their impact on the replication efficiency and lifetime of micro/nano-molds that are used in micro-nano hot-embossing and injection molding processes are discussed.
Abstract
Micro/nano hot-embossing and injection molding are two promising manufacturing processes for the mass production of workpieces bearing micro/nanoscale features. However, both the workpiece and micro/nano-mold are susceptive to structural damage due to high thermal stress, adhesion and friction, which occur at the interface between the workpiece and the mold during these processes. Hence, major constraints of micro/nano-molds are mainly attributed to improper replication and their inability to withstand a prolonged sliding surface contact because of high sidewall friction and/or high adhesion. Consequently, there is a need for proper surface coating as it can improve the surface properties of micro/nano-molds such as having a low friction coefficient, low adhesion and low wear rate. This review deals with the physical, mechanical and tribological properties of various surface coatings and their impact on the replication efficiency and lifetime of micro/nano-molds that are used in micro/nano hot-embossing and injection molding processes.

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Citations
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Frictional Characteristics of Atomically-Thin Sheets

TL;DR: Using friction force microscopy, the nanoscale frictional characteristics of atomically thin sheets of graphene, molybdenum disulfide, niobium diselenide, and hexagonal boron nitride are compared to those of their bulk counterparts, suggesting that the trend arises from the thinner sheets’ increased susceptibility to out-of-plane elastic deformation.
Journal ArticleDOI

Micro-nanostructured polymer surfaces using injection molding: A review

TL;DR: In this article, the influence of processing parameters on the quality of final parts and the precision of final product dimensions in both thermoplastic polymers and rubber materials is discussed and compared.
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Solvent-aided direct adhesion of a metal/polymer joint using micro/nano hierarchical structures

TL;DR: In this article, a new direct adhesion method is introduced that does not require additional heat management and instead makes use of an organic solvent, which is used to bond micro/nanostructured aluminum and acrylonitrile butadiene styrene.
References
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Journal ArticleDOI

Nanopattern insert molding

TL;DR: A new method was investigated to produce nanopatterns on polymeric surfaces with high resolution, good productivity, and low cost when compared with such conventional techniques as nanoimprint lithography, hot embossing, and injection molding.
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Micro-hot-embossing of 316L stainless steel micro-structures

TL;DR: In this article, the effects of various embossing parameters on the filling of the micro-cavities of silicon mold insert and the demolding of micro-structures are investigated.
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The demolding of powder injection molded micro-structures: analysis, simulation and experiment

TL;DR: In this paper, the demolding of an array of powder injection molded micro-structures based on a variotherm mold was analyzed both theoretically and experimentally, and it was found that there exists a "critical temperature" at which the deformation force for the microstructures array is a minimum.
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Fabrication of metal-based high-aspect-ratio microscale structures by compression molding

TL;DR: In this article, the authors summarize their recent results on molding replication of metal-based high-aspect-ratio microscale structures (HARMSs) are basic building blocks for metallic microdevices such as microelectromagnetic relays and microchannel heat exchangers.
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Microstructured silicon membrane with soft suspension beams for a high performance MEMS microspeaker

TL;DR: In this paper, an acoustic emissive surface based on a very light but very stiff structured silicon membrane was designed and microfabricated, for which undesirable vibration modes were reduced to only three within the microspeaker bandwidth.
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