scispace - formally typeset
Journal ArticleDOI

A Systematic Review of Reliability Issues in RF-MEMS Switches

TLDR
In this paper, different failure modes in the RF-MEMS switches like stiffness, residual stress, cyclic fatigue, creep, wear, and packaging are reviewed and the origin of these failure modes, their characterization procedure and respective solutions presented in the literature are presented to get a better understanding of the state of the art work done in the field of RFMEMS reliability.
Abstract
\n\nThe main challenge in the commercialization of the RF-MEMS switches is their reliability,\nrelated to both the electrical and mechanical domains. The development of test standards and understanding\nthe underlying physics of different failure modes has always been of major concern for the\nRF-MEMS designers. This paper reviews the different failure modes in the RF-MEMS switches like\nstiction, residual stress, cyclic fatigue, creep, wear and packaging in detail. The origin of these failure\nmodes, their characterization procedure and respective solutions presented in the literature are presented\nto get a better understanding of the state of the art work done in the field RF-MEMS reliability\nfor nearly past two decades.\n

read more

Citations
More filters
Journal ArticleDOI

A review on RF micro-electro-mechanical-systems (MEMS) switch for radio frequency applications

TL;DR: In this article, a review of the MEMS switch by considering key aspects on the basis of mechanical structure, actuation methods, and types of contact and circuit configurations are explored and discussed.
Journal ArticleDOI

Surface roughness effects on electromechanical performance of RF-MEMS capacitive switches

TL;DR: In this article, the effect of surface roughness on the electromechanical performance of radio frequency micro-electromechanical system (RF-MEMS) based capacitive switches is an important reliability concern.
Journal ArticleDOI

Reliability of RF MEMS switches at cryogenic (liquid He) temperatures

TL;DR: In this paper, the reliability of RF MEMS switches operating in a cryogenic environment was investigated and the authors reported that the switches operated in a state-of-the-art performance.
Journal ArticleDOI

An efficient design of dual-axis MEMS accelerometer considering microfabrication process limitations and operating environment variations

TL;DR: An efficient design approach for the micro electromechanical systems (MEMS) accelerometers considering design parameters affecting the long-term reliability of these inertial sensors in comparison to traditional iterative microfabrication and experimental characterization approach is presented.
Journal ArticleDOI

Investigations on beam membrane and dielectric materials using Ashby’s methodology and their impact on the performance of a MEMS capacitive switch

TL;DR: In this paper, Ashby's material selection methodology is employed for choosing the best material for the beam membrane and dielectric layer by investigating a database of materials, including Young's modulus, Poisson's ratio, thermal coefficient, electrical resistivity, thermal conductivity, and fracture strength.
References
More filters
Journal ArticleDOI

The Tension of Metallic Films Deposited by Electrolysis

TL;DR: It is well known that metallic films deposited electrolytically are in many cases liable to peel off if deposited to any considerable thickness as discussed by the authors, especially if it does not adhere very tightly to the body on which it is deposited.
Journal ArticleDOI

Plasticity in small-sized metallic systems: Intrinsic versus extrinsic size effect

TL;DR: In this paper, the authors provide an overview of metal-based material classes whose properties as a function of external size have been investigated and provide a critical discussion on the combined effects of intrinsic and extrinsic sizes on the material deformation behavior.
Journal ArticleDOI

Size effects in materials due to microstructural and dimensional constraints: a comparative review

TL;DR: In this article, the effects of size on predominantly mechanical properties of materials are reviewed at a first-order level, and important aspects can be understood from the point of view of the interaction of a characteristic length (which may be as diverse as the dislocation radius of curvature at a given stress or the magnetic exchange length) with a size parameter (grain or particle size, or film thickness).
Journal ArticleDOI

A first report on deformation-mechanism maps

TL;DR: Deformations-mechanism maps as discussed by the authors display the fields of stress and temperature in which a particular mechanism of plastic flow is dominant, i.e., dislocation glide, diffusional flow and dislocation creep.
Journal ArticleDOI

Micro-Raman spectroscopy to study local mechanical stress in silicon integrated circuits

TL;DR: In this article, the theoretical background of Raman spectroscopy, with special attention to its sensitivity for mechanical stress, is discussed, and practical information is given for the application of this technique to stress measurements in silicon integrated circuits.
Related Papers (5)