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Capacitor that includes high permittivity capacitor dielectric

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TLDR
In this article, a decoupling capacitor is formed on a semiconductor substrate that includes a silicon surface layer, and a substantially flat bottom electrode is formed in a portion of the semiconductor surface layer.
Abstract
A decoupling capacitor is formed on a semiconductor substrate that includes a silicon surface layer. A substantially flat bottom electrode is formed in a portion of the semiconductor surface layer. A capacitor dielectric overlies the bottom electrode. The capacitor dielectric is formed from a high permittivity dielectric with a relative permittivity, preferably greater than about 5. The capacitor also includes a substantially flat top electrode that overlies the capacitor dielectric. In the preferred application, the top electrode is connected to a first reference voltage line and the bottom electrode is connected to a second reference voltage line.

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Citations
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References
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Defects in epitaxial multilayers: I. Misfit dislocations*

TL;DR: In this paper, it was shown that the interfaces between layers were made up of large coherent areas separated by long straight misfit dislocations and the Burgers vectors were inclined at 45° to (001) and were of type 1/2a.
Journal ArticleDOI

Defects associated with the accommodation of misfit between crystals

TL;DR: In this article, a substantial fraction of the defects in epitaxial thin films are formed to accommodate part of the misfit between the stress-free lattice parameters of film and substrate.
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Beyond the conventional transistor

TL;DR: In this paper, the authors focus on approaches to continue CMOS scaling by introducing new device structures and new materials, including high-dielectric-constant (high-k) gate dielectric, metal gate electrode, double-gate FET and strained-silicon FET.
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Finfet transistor structures having a double gate channel extending vertically from a substrate and methods of manufacture

TL;DR: In this article, a planar MOSFET is fabricated in a silicon layer overlying an insulating layer (e.g., SIMOX) with the device extending from the insulating layers as a fin.