Journal ArticleDOI
Challenges in Electronic Cooling—Opportunities for Enhanced Thermal Management Techniques—Microprocessor Liquid Cooled Minichannel Heat Sink
TLDR
A microprocessor liquid cooled minichannel heat sink will be described and its performance presented as it applies to a current microprocessor (IBM Power4) chip.Abstract:
The volumetric heat dissipated by computer equipment at each level of the package from the chip to the chassis is having a tremendous impact on the thermal management of computer equipment. Because of the consumer's insatiable desire for increased performance, the competitive pressures are driving the computer manufacturer to pack as much processor/memory performance within the smallest volume possible. The consumer views high performance in a compact package as a benefit. These market pressures seem to be in direct conflict with the desire to continue to provide air cooling solutions for the foreseeable future. Because of these trends in power and package design, other cooling technologies beside air are now becoming viable, techniques, but each must be weighed with many other factors that influence the cooling technology selected. These factors will be discussed along with two specific IBM server packages and their associated cooling technology employed. Finally a microprocessor liquid cooled minichanne...read more
Citations
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Journal ArticleDOI
Heat Transfer in Nanofluids—A Review
TL;DR: In this paper, the authors present an exhaustive review of the literature in this area and suggest a direction for future developments, including heat transfer, material science, physics, chemical engineering and synthetic chemistry.
Journal ArticleDOI
An Extension of the Flow Boiling Correlation to Transition, Laminar, and Deep Laminar Flows in Minichannels and Microchannels
TL;DR: In this paper, a flow boiling correlation for large diameter tubes developed by Kandlikar [1, 2] is modified for flow boiling in minichannels by using the laminar single-phase heat transfer coefficient for all liquid flow.
Journal ArticleDOI
Numerical study of laminar heat transfer and pressure drop characteristics in a water-cooled minichannel heat sink
TL;DR: In this paper, the effects of channel dimensions, channel wall thickness, bottom thickness and inlet velocity on the pressure drop, thermal resistance and the maximum allowable heat flux are presented.
Journal ArticleDOI
Review of micro- and mini-channel heat sinks and heat exchangers for single phase fluids
Tisha Dixit,Indranil Ghosh +1 more
TL;DR: In this paper, a review of micro-and minichannel heat exchangers as heat sinks and heat exchanger has been presented, and the persisting lacunae of this technology drawn from the review have been pointed out.
Journal ArticleDOI
Thermal optimization of PCM based pin fin heat sinks: An experimental study
Rajesh Baby,Chakravarthy Balaji +1 more
TL;DR: In this paper, an experimental investigation carried out to characterize the thermal performance of different configurations of phase change material (PCM) based pin fin heat sinks was carried out and the results showed that there exists sufficient scope to optimize the thermal design of the heat sink.
References
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Journal ArticleDOI
Cramming More Components Onto Integrated Circuits
TL;DR: Integrated circuits will lead to such wonders as home computers or at least terminals connected to a central computer, automatic controls for automobiles, and personal portable communications equipment as mentioned in this paper. But the biggest potential lies in the production of large systems.
Journal Article
Cramming More Components onto Integrated Circuits
TL;DR: Integrated circuits will lead to such wonders as home computers or at least terminals connected to a central computer, automatic controls for automobiles, and personal portable communications equipment as discussed by the authors. But the biggest potential lies in the production of large systems.
Journal ArticleDOI
High-performance heat sinking for VLSI
TL;DR: In this paper, a water-cooled integral heat sink for silicon integrated circuits has been designed and tested at a power density of 790 W/cm2, with a maximum substrate temperature rise of 71°C above the input water temperature.
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Journal Article
Progress in digital integrated electronics
TL;DR: In this article, the authors examined how long exponent i a l g r o w t h i n c o n t r i b u t i o n s h a v e been i m p o r t a n t i n t e c o m p l e x i e x p e c t e m e r e r i n f i g u r e I n t o d i f e r E I n f ǫ r e c e t e r m e n t and how t h e y m i g