Journal ArticleDOI
D-Band Micromachined Silicon Rectangular Waveguide Filter
TLDR
In this paper, a 140 GHz silicon micromachined bandpass rectangular waveguide filters are firstly fabricated by the deep reactive ion etching (DRIE) processes for submillimeter wave applications.Abstract:
The 140 GHz silicon micromachined bandpass rectangular waveguide filters are firstly fabricated by the deep reactive ion etching (DRIE) processes for submillimeter wave applications. The filter circuit structure is once-formed using the ICP reactive ion etcher to etch through the full thickness of the silicon wafer, and then bonded together with the two metallized glass covers to form the waveguide cavity. The measured lowest insertion losses are lower than 0.5 dB. The unloaded quality factor can reach 160. It demonstrates a successful and practical way to fabricate these types of waveguide filters.read more
Citations
More filters
Journal ArticleDOI
$W$ -Band Waveguide Filters Fabricated by Laser Micromachining and 3-D Printing
Xiaobang Shang,Pavel Penchev,Cheng Guo,Michael J. Lancaster,Stefan Simeonov Dimov,Yuliang Dong,Mirko Favre,Mathieu Billod,Emile de Rijk +8 more
TL;DR: In this paper, two W-band waveguide bandpass filters were fabricated using laser micromachining and 3-D printing techniques, one fabricated from a single metal workpiece and the other from polymer resin.
Journal ArticleDOI
Micromachined Terahertz Rectangular Waveguide Bandpass Filter on Silicon-Substrate
Jiang Hu,Shanyi Xie,Yong Zhang +2 more
TL;DR: In this article, a micromachined 385 GHz rectangular waveguide cavity bandpass filter is presented, which is fabricated using deep reactive ion etching on silicon substrate, with sputtered gold inner surface metallization.
Journal ArticleDOI
Novel Air-Filled Waveguide Transmission Line Based on Multilayer Thin Metal Plates
TL;DR: In this article, an air-filled multilayer waveguide (MLW) transmission line is successfully designed and manufactured at the $D$ -band by stacking several thin metal plates for millimeter-wave and terahertz applications.
Journal ArticleDOI
Silicon Micromachined Terahertz Bandpass Filter With Elliptic Cavities
TL;DR: In this article, a 400 GHz silicon micromachined elliptic cavity waveguide filter with two transmission zeros on both sides of the passband is presented, where the filter is cascaded by two elliptic cavities which are operating at quasi-110$ mode.
Journal ArticleDOI
U-Shape Slots Structure on Substrate Integrated Waveguide for 40-GHz Bandpass Filter Using LTCC Technology
TL;DR: In this article, a millimeter-wave (mmW) bandpass filter using substrate integrated waveguide (SIW) is proposed and three different types of electromagnetic bandgap (EBG) units are discussed and compared with their passbands and stopbands performance.
References
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Journal ArticleDOI
Micromachining for terahertz applications
TL;DR: An overview of recent progress in the research and development of micromachined antennas, transmission lines, waveguides structures, and planar movable components for terahertz frequencies is presented in this article.
Journal ArticleDOI
Micromachined W-band filters
TL;DR: In this paper, two types of micromachined planar transmission lines are studied: microshield line and shielded membrane microstrip (SMM) line, in which the conducting lines are suspended on thin dielectric membranes.
Journal ArticleDOI
Terahertz vacuum electronic circuits fabricated by UV lithographic molding and deep reactive ion etching
TL;DR: The 0.22 THz vacuum electronic circuits fabricated by UV lithography molding and deep reactive ion etching processes are under investigation for submillimeter wave applications in this paper.
Journal ArticleDOI
A 250-GHz microshield bandpass filter
TL;DR: In this article, a planar bandpass filter based on a half-shielded transmission line was designed and tested at 130-360 GHz with a 58% relative bandwidth at 250 GHz, demonstrating the excellent performance of the microshield geometry.
Journal ArticleDOI
Silicon Micromachined W-Band Hybrid Coupler and Power Divider Using DRIE Technique
TL;DR: In this article, a silicon micromachined W-band hybrid coupler and a power divider using deep-reactive ion etching (DRIE) technique are presented.