Journal ArticleDOI
Development of 30 Watt high-power LEDs vapor chamber-based plate
TLDR
In this paper, the authors used experimental analysis with window program VCTM V1.0 to investigate the thermal performance of the vapor chamber and apply to 30 Watt high-power LEDs.About:
This article is published in International Journal of Heat and Mass Transfer.The article was published on 2010-09-01. It has received 97 citations till now. The article focuses on the topics: Thermal conductivity & Heat transfer.read more
Citations
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Thermal management of LEDs: Package to system
TL;DR: In this paper, the effect of chip packages on junction to board thermal resistance was compared for both SiC and Sapphire chips, and a conceptual LED illumination system was chosen and CFD models were created to determine the availability and limitations of passive air-cooling.
Journal ArticleDOI
A review of small heat pipes for electronics
TL;DR: A review of small heat pipes, including their design, analysis, and fabrication, is presented in this article, where the authors also discuss the potential of nano-wicks, such as carbon nanotubes (CNTs), to represent the future of heat pipes.
Journal ArticleDOI
Thermal investigations on LED vapor chamber-based plates
TL;DR: In this paper, the thermal performance of the LED vapor chamber-based plate is compared with the LED copper based plate with an input power above 5 W. And the experimental thermal resistance values of LED copper and vapor chamber based plate are 0.41°C/W and 0.38°C /W at 6 W respectively.
Journal ArticleDOI
A Review of Vapor Chambers
TL;DR: In this paper, the authors proposed a cooling system to dissipate large amount of heat produced over a small area in electronic industry, which will require efficient cooling systems to enable the development in electronic industries.
Journal ArticleDOI
Study on heat transfer performance of an aluminum flat plate heat pipe with fins in vapor chamber
Hao Peng,Juan Li,Xiang Ling +2 more
TL;DR: In this paper, the heat transfer performance of a flat plate heat pipe (FPHP) for electronic cooling was investigated experimentally, and the experimental results indicated that the filling ratio and vacuum degree had a significant influence on thermal performance of FPHP.
References
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Journal ArticleDOI
Integrated thermal management techniques for high power electronic devices
TL;DR: In this paper, the development of microprocessing technology and present a project being carried out to develop combined two-phase heat transfer and heat pipe technology with forced air convection and liquid condenser systems.
Proceedings ArticleDOI
Thermal management of LEDs: package to system
TL;DR: In this paper, the effect of chip packages on junction to board thermal resistance was compared for both SiC and Sapphire chips, and a conceptual LED illumination system was chosen and CFD models were created to determine the availability and limitations of passive air-cooling.
Thermal management of LEDs: Package to system
TL;DR: In this paper, the effect of chip packages on junction to board thermal resistance was compared for both SiC and Sapphire chips, and a conceptual LED illumination system was chosen and CFD models were created to determine the availability and limitations of passive air-cooling.
Journal ArticleDOI
Thermal analysis of LED array system with heat pipe
TL;DR: In this article, the junction temperatures of high power LED arrays with and without heat pipe at the same air velocity of 7 m/s were reported to be 87.6 °C and 63.3 °C, respectively.
Proceedings ArticleDOI
Thermal challenges in the future generation solid state lighting applications: light emitting diodes
TL;DR: The luminous efficiency of LEDs is expected to reach over 80 lumens/watt, that is approximately 6 times more than one tungsten bulb as discussed by the authors, and the thermal challenges of these products in many applications will open new research areas for engineers from chip level to system level thermal management.