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Book ChapterDOI

Features of Surface Micromachining and Wafer Bonding Process

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The article was published on 2006-01-01. It has received 1 citations till now. The article focuses on the topics: Bulk micromachining & Anodic bonding.

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Citations
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LPCVD silicon dioxide sacrificial layer etching for surface micromachining

TL;DR: In this paper, a 1 fum silicon-rich silicon nitride structural layer was deposited on a 2 fum phosphosilicate glass (PSG) sacrificial layer that had been installed on a single-crystal silicon wafer.
References
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Journal ArticleDOI

Silicon as a mechanical material

TL;DR: This review describes the advantages of employing silicon as a mechanical material, the relevant mechanical characteristics of silicon, and the processing techniques which are specific to micromechanical structures.
Journal Article

Silicon as a mechanical material

TL;DR: In this article, the advantages of employing silicon as a mechanical material, the relevant mechanical characteristics of silicon, and the processing techniques which are specific to micromechanical structures are discussed.
Journal ArticleDOI

Mechanical properties of thin films

TL;DR: In this paper, it is shown that very large stresses may be present in the thin films that comprise integrated circuits and magnetic disks and that these stresses can cause deformation and fracture to occur.
Book

Fundamentals of microfabrication

TL;DR: The second edition of the Fundamentals of Microfabrication as discussed by the authors provides an in-depth coverage of the science of miniaturization, its methods, and materials, from the fundamentals of lithography through bonding and packaging to quantum structures and molecular engineering.
Journal ArticleDOI

Piezoresistance Effect in Germanium and Silicon

TL;DR: In this article, the complete tensor piezoresistance has been determined experimentally for these materials and expressed in terms of the pressure coefficient of resistivity and two simple shear coefficients.