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Journal ArticleDOI

Heat transfer enhancement using Al2O3–water nanofluid for an electronic liquid cooling system

TLDR
In this article, the authors investigated the behavior and heat transfer enhancement of a particular nanofluid, Al2O3 nanoparticle-water mixture, flowing inside a closed system that is destined for cooling of microprocessors or other electronic components.
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This article is published in Applied Thermal Engineering.The article was published on 2007-06-01. It has received 575 citations till now. The article focuses on the topics: Nanofluid & Heat transfer enhancement.

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Proceedings ArticleDOI

Nanofluids for electronics cooling

TL;DR: In this article, the authors investigated experimentally the thermal performance of an electronics cooling system which is available in the market and found that nanofluids, with low volume concentration (1 percent vol) of Alumina particles decreases the maximum temperature of the system, almost 27 degree Celcius, compared to water.
Journal ArticleDOI

Optimization and Evaluation of a High-Performance Liquid Metal CPU Cooling Product

TL;DR: In this article, the authors present theoretical optimization and experimental investigations on a practical liquid metal CPU cooling product, where a former working prototype developed in the lab, a series of critical parameters were identified and the optimization criterion was established.
Journal ArticleDOI

Pressure Drop and Heat Transfer of Nanofluid in Turbulent Pipe Flow Considering Particle Coagulation and Breakage

TL;DR: In this paper, numerical simulations of Al2O3/water nanofluid in turbulent pipe flow are performed with considering the particle convection, diffusion, coagulation, and breakage.
Journal ArticleDOI

Experimental study of ethylene glycol-based Al2O3 nanofluid turbulent heat transfer enhancement in the corrugated tube with twisted tapes

TL;DR: In this article, the thermal performance of the heat exchanger with nanofluid and twisted tapes was evaluated for the assessment of overall improvement in thermal behavior. But, the performance was not evaluated for high nanoparticle concentration.
Journal ArticleDOI

Single-Phase Forced Convection in Microchannels with Carbon Nanotubes for Electronics Cooling Applications

TL;DR: In this article, a comparative experimental study was conducted to determine whether it would be advantageous to grow carbon nanotubes on the bottom surface of silicon microchannels to facilitate greater heat removal in electronics cooling applications.
References
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Journal ArticleDOI

Hydrodynamic and heat transfer study of dispersed fluids with submicron metallic oxide particles

TL;DR: In this article, the authors used a Brookfield rotating viscometer to measure the viscosities of the dispersed fluids with γ-alumina (Al2O3) and titanium dioxide (TiO2) particles at a 10% volume concentration.
Journal ArticleDOI

Anomalously increased effective thermal conductivities of ethylene glycol-based nanofluids containing copper nanoparticles

TL;DR: In this paper, it was shown that a "nanofluid" consisting of copper nanometer-sized particles dispersed in ethylene glycol has a much higher effective thermal conductivity than either pure or pure glycol or even polyethylene glycol containing the same volume fraction of dispersed oxide nanoparticles.
Journal ArticleDOI

Anomalous thermal conductivity enhancement in nanotube suspensions

TL;DR: In this paper, the authors have produced nanotube-in-oil suspensions and measured their effective thermal conductivity, which is anomalously greater than theoretical predictions and is nonlinear with nanotubes loadings.
Journal ArticleDOI

Conceptions for heat transfer correlation of nanofluids

TL;DR: In this article, the authors proposed two different approaches for deriving heat transfer correlation of the nanofluid, and investigated the mechanism of heat transfer enhancement of the nano-fluid.
Journal ArticleDOI

Thermal Conductivity of Nanoparticle -Fluid Mixture

TL;DR: In this paper, the authors measured the effective thermal conductivity of mixtures of Al 2O3 and CuO, dispersed in water, vacuum pump, engine oil, and ethylene glycol.
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