Journal ArticleDOI
Heat transfer enhancement using Al2O3–water nanofluid for an electronic liquid cooling system
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TLDR
In this article, the authors investigated the behavior and heat transfer enhancement of a particular nanofluid, Al2O3 nanoparticle-water mixture, flowing inside a closed system that is destined for cooling of microprocessors or other electronic components.About:
This article is published in Applied Thermal Engineering.The article was published on 2007-06-01. It has received 575 citations till now. The article focuses on the topics: Nanofluid & Heat transfer enhancement.read more
Citations
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Experimental Studies on Heat Transfer and Friction Factor Characteristics of Al2O3/Water Nanofluid in a Circular Pipe Under Transition Flow With Wire Coil Inserts
TL;DR: In this paper, the effects of the pitch ratio and nanofluid on the Nusselt number and the friction factor are determined in a circular tube with fully developed transition flow for Reynolds number in the range of 2500 to 5000.
Journal ArticleDOI
Anomalous enhancement in thermal conductivity of nanofluid induced by solid walls in a nanochannel
TL;DR: In this article, the thermal conductivity of Ar-Cu nanofluid confined between two parallel walls (in a nanochannel) is calculated by equilibrium-molecular-dynamics simulation through Green-Kubo formula.
Journal ArticleDOI
Exergy and entropy generation analysis of TiO2–water nanofluid flow through the water block as an electronics device
TL;DR: In this article, the authors experimentally analyzed exergy and entropy generation of TiO2-water nanofluid for cooling of a water block as an electronic device, and they found that the exergy gain was augmented for the adding of nanoparticle into the water and fallen with the rise of flow rate.
Journal ArticleDOI
Assessment of heat dissipation performance for nanofluid
TL;DR: In this article, the feasibility of alumina (Al 2 O 3 )/water nanofluid for these cooling systems using an air-cooled heat exchanger for heat dissipation was evaluated.
Journal ArticleDOI
Hybrid liquid metal-water cooling system for heat dissipation of high power density microdevices
Yueguang Deng,Jing Liu +1 more
Abstract: The recent decades have witnessed a remarkable advancement of very large scale integrated circuits (VLSI) and electronic equipments in micro-electronic industry. Meanwhile, the ever increasing power density of microdevices leads to the tough issue that thermal management becomes rather hard to solve. Conventional water cooling is widely used, but the convective coefficient is not high enough. Liquid metal owns much higher convective coefficient and has been identified as an effective coolant recently, but the high cost greatly precludes its large scale utilization. In this paper, a hybrid liquid metal–water cooling system which combines the advantages of both water and liquid metal cooling was proposed and demonstrated. By utilizing a liquid metal “heat spreader” in front of the water cooling module, this system not only owns more excellent cooling capability than that based on water alone, but also has much lower initial cost compared with absolute liquid metal cooling system. A series of experiments under different operation conditions have been performed to evaluate the cooling performance of this hybrid system. The compared results with absolute water cooling and liquid metal cooling system showed that the cooling capability of the new system is competitive with absolute liquid metal cooling, but the initial cost could be much lower. The theoretical thermal resistance model and economic feasibility also have been analyzed and discussed, which shows that the hybrid liquid metal–water cooling system is quite feasible and useful.
References
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Journal ArticleDOI
Hydrodynamic and heat transfer study of dispersed fluids with submicron metallic oxide particles
Bock Choon Pak,Young I. Cho +1 more
TL;DR: In this article, the authors used a Brookfield rotating viscometer to measure the viscosities of the dispersed fluids with γ-alumina (Al2O3) and titanium dioxide (TiO2) particles at a 10% volume concentration.
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Anomalously increased effective thermal conductivities of ethylene glycol-based nanofluids containing copper nanoparticles
TL;DR: In this paper, it was shown that a "nanofluid" consisting of copper nanometer-sized particles dispersed in ethylene glycol has a much higher effective thermal conductivity than either pure or pure glycol or even polyethylene glycol containing the same volume fraction of dispersed oxide nanoparticles.
Journal ArticleDOI
Anomalous thermal conductivity enhancement in nanotube suspensions
TL;DR: In this paper, the authors have produced nanotube-in-oil suspensions and measured their effective thermal conductivity, which is anomalously greater than theoretical predictions and is nonlinear with nanotubes loadings.
Journal ArticleDOI
Conceptions for heat transfer correlation of nanofluids
Yimin Xuan,Wilfried Roetzel +1 more
TL;DR: In this article, the authors proposed two different approaches for deriving heat transfer correlation of the nanofluid, and investigated the mechanism of heat transfer enhancement of the nano-fluid.
Journal ArticleDOI
Thermal Conductivity of Nanoparticle -Fluid Mixture
TL;DR: In this paper, the authors measured the effective thermal conductivity of mixtures of Al 2O3 and CuO, dispersed in water, vacuum pump, engine oil, and ethylene glycol.
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