Open AccessBook
Heat-transfer microstructures for integrated circuits
TLDR
In this paper, a liquid partially fills an array of micron-wide repentant capillaries in the heat sink substrate, so that surface tension holds the polished back of an IC in intimate thermal contact with the sink.Abstract:
: The design of high-speed integrated circuits and systems is often constrained by thermal considerations. As late as 1981 it was authoritatively predicted that the maximum achievable power flux for liquid-cooled, densely-packed integrated circuits (ICs) would be about 20 W/sq cm. Convective heat-transfer theory indicates that well over 1000 W/sq cm can be compactly removed from ICs at normal operating temperatures, provided microscopic (e.g., 50-microns wide) extended-surface structures are used. The difficulty of constructing high-conductance, low-stress thermal interfaces between ICs and heat sinks suggests the use of an integral heat sink. Accordingly, IC microfabrication techniques were employed to design, fabricate, and test novel, ultracompact water-cooled, laminar-flow, optimized plate-fin and pin-fin heat sinks directly within standard-thickness silicon substrates. Worst-case thermal resistances as low as 0.083 deg C/W were measured from 1-sq cm thin-film resistors (e.g., a 108 deg C temperature rise at 1309 W), in good agreement with predictions. Further increases in heat transfer are achievable. The use of integral liquid-cooled heat sinks in multichip systems presents potential yield, reliability, cost and packaging problems. Attachment of unmodified ICs to micro-heat sinks seems a more attractive approach. A novel die-attachment technique has been developed which avoids the problems of conventional attachments. In this technique, a liquid partially fills an array of micron-wide repentant capillaries in the heat sink substrate, so that surface tension holds the polished back of an IC in intimate thermal contact with the heat sink. The bond is void-free, virtually stress-free, long-lived, and allows repeated detachment and replacement of ICs without damaging the heat sink substrate. The repentant grooves were fabricated by a novel process using electroless plating of nickel onto vertical silicon microgrooves.read more
Citations
More filters
Journal ArticleDOI
The Fluid Mechanics of Microdevices—The Freeman Scholar Lecture
TL;DR: In this article, the authors review the status of the understanding of fluid flow phenomena particular to microdevices and emphasize the use of MEMS as sensors and actuators for flow diagnosis and control.
Journal ArticleDOI
Flow characteristics of water in microtubes
Gh. Mohiuddin Mala,Dongqing Li +1 more
TL;DR: In this paper, a roughness-viscosity model was proposed to interpret the experimental data and the results indicated significant departure of flow characteristics from the predictions of the conventional theory for microtubes with smaller diameters.
Journal ArticleDOI
Gas flow in micro-channels
TL;DR: In this article, an experimental and theoretical investigation of low Reynolds number, high subsonic Mach number, compressible gas flow in channels was presented, and the measured friction factor was in good agreement with theoretical predictions assuming isothermal, locally fully developed, first-order slip flow.
Journal ArticleDOI
A Comparative Analysis of Studies on Heat Transfer and Fluid Flow in Microchannels
TL;DR: In this paper, a compilation and analysis of the results from investigations on fluid flow and heat transfer in micro- and mini-channels and microtubes in the literature is presented, with a special emphasis on quantitative experimental results and theoretical predictions.
Journal ArticleDOI
Frictional flow characteristics of water flowing through rectangular microchannels
TL;DR: In this paper, the authors investigated the flow characteristics of water flowing through rectangular microchannels having hydraulic diameters of 0.133-0.367 mm and H/W ratios between 0.333-1.72i.
References
More filters
Book
CRC Handbook of Chemistry and Physics
TL;DR: CRC handbook of chemistry and physics, CRC Handbook of Chemistry and Physics, CRC handbook as discussed by the authors, CRC Handbook for Chemistry and Physiology, CRC Handbook for Physics,
Book
Introduction to solid state physics
TL;DR: In this paper, the Hartree-Fock Approximation of many-body techniques and the Electron Gas Polarons and Electron-phonon Interaction are discussed.
Journal ArticleDOI
High-performance heat sinking for VLSI
TL;DR: In this paper, a water-cooled integral heat sink for silicon integrated circuits has been designed and tested at a power density of 790 W/cm2, with a maximum substrate temperature rise of 71°C above the input water temperature.
Journal ArticleDOI
Compact heat exchangers
TL;DR: The third edition of the second edition as discussed by the authors was published in 1964 and contains basic test data for eleven new surface configurations, including some of the very compact ceramic matrices, in both the English and the Systeme International (SI) system of units.
Related Papers (5)
Experimental Investigation on Liquid Forced-Convection Heat-Transfer Through Microchannels
B. X. Wang,Xiaofeng Peng +1 more