Journal ArticleDOI
High performance polyimides for applications in microelectronics and flat panel displays
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TLDR
In this article, a review of the recent research progresses in characterizing polyimides and their precursors and in developing low dielectric constant, light-emitting, and liquid crystal alignment layer PIs is presented.Abstract:
Polyimides (PIs) exhibit excellent thermal stability, mechanical, dielectric, and chemical resistance properties due to their heterocyclic imide rings and aromatic rings on the backbone. Due to these advantageous properties, PIs have found diverse applications in industry. Most PIs are insoluble because of the nature of the high chemical resistance. Thus, they are generally used as a soluble precursor polymer, which forms complexes with solvent molecules, and then finally converts to the corresponding polyimides via imidization reaction. This complexation with solvent has caused severe difficulty in the characterization of the precursor polymers. However, significant progress has recently been made on the detailed characterization of PI precursors and their imidization reaction. On the other hand, much research effort has been exerted to reduce the dielectric constant of PIs, as demanded in the microelectronics industry, through chemical modifications, as well as to develop high performance, light-emitting PIs and liquid crystal (LC) alignment layer PIs with both rubbing and rubbing-free processibility, which are desired in the flat-panel display industry. This article reviews this recent research progresses in characterizing PIs and their precursors and in developing low dielectric constant, light-emitting, and LC alignment layer PIs.read more
Citations
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Journal ArticleDOI
Electrospun polyimide nanofibers and their applications
TL;DR: Aromatic polyimides (PIs) are high-performance polymers with rigid heterocyclic imide rings and aromatic benzene rings in their macromolecular backbones as mentioned in this paper.
Journal ArticleDOI
Synthesis, characterization, and properties of fully aliphatic polyimides and their derivatives for microelectronics and optoelectronics applications
TL;DR: In this paper, the recent research process in synthesizing fully aliphatic polyimides, with improved dimensional stability, high transparency and low e values, as well as the characterizations and future scope for their application in micro electric and photo-electronic industries, is reviewed.
Journal ArticleDOI
Recent Progress in Aromatic Polyimide Dielectrics for Organic Electronic Devices and Circuits.
TL;DR: A brief overview of recent progress in PI-based dielectrics for organic electronic devices and circuits is provided and an outlook of future research directions and challenges for polyimide dielectric materials is presented.
Journal ArticleDOI
Triptycene Polyimides: Soluble Polymers with High Thermal Stability and Low Refractive Indices
TL;DR: A series of thermally stable aromatic polyimides were synthesized using commercially available five and six-membered ring anhydrides and 2,6-diaminotriptycene derivatives as mentioned in this paper.
Journal ArticleDOI
Novel low-κ polyimide/mesoporous silica composite films: Preparation, microstructure, and properties
Jingjing Lin,Xiaodong Wang +1 more
TL;DR: In this article, a series of low-dielectric constant polyimide (PI) composite films containing SBA-15 or SBA16 type mesoporous silica were successfully prepared via in situ polymerization and following thermal imidization.
References
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Journal ArticleDOI
New Clues to the Factors Governing the Perpendicular Alignment of Liquid Crystals on Rubbed Polystyrene Film Surfaces
Seung-Woo Lee,Boknam Chae,Hak Chul Kim,Byeongdu Lee,Woo-Young Choi,Seung Bin Kim,Taihyun Chang,Moonhor Ree +7 more
TL;DR: The authors investigated the surfaces of rubbed polystyrene (PS) films in detail using atomic force microscopy and discovered a previously unknown surface feature: submicroscale meandering groove-like structures composed of gravel-like grooves in tens of nanometers.
Journal ArticleDOI
Synthesis and characterization of new, soluble polyazomethines bearing fluorene and carbazole units in the backbone and solubility‐improving moieties in the side group
TL;DR: A series of polyazomethines bearing fluorene and carbazole moieties in the main chain and solubility-improving side group (dibutyl, ethylhexyl, thienylethyloxy, furyl, and fluorenyl) were synthesized in this paper.
Journal ArticleDOI
Residual stress behaviour of isomeric PMDA-ODA polyimides
TL;DR: In this paper, the authors investigated the residual stress behavior of poly(4,4′-oxydiphenylene pyromellitimide (PMDA-4, 4′-ODA) and poly(amic acid) precursors in the condensed state on Si wafers.
Journal ArticleDOI
Molecular Orientation of Rubbed and Unrubbed Polyimide Films Determined by Polarized Infrared Absorption
TL;DR: In this paper, the orientations of poly[ 4,4'-oxydiphenylene-pyromellitimide] (PMDA-ODA) molecules in rubbed and unrubbed polyimide films ( ~120 A) on Si substrates were determined by polarized IR absorption spectroscopy.
Journal ArticleDOI
Synthesis and characterization of new polyimides containing calix[4]arenes in the polymer backbone
TL;DR: In this paper, diaminocalix[4]arene precursors were converted to the corresponding copolyimides in films, which are amorphous but insoluble in common solvents.