Journal ArticleDOI
Optimal Design of Three-Dimensional Heat Flow Structures for Power Electronics Applications
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TLDR
In this article, a three-dimensional (3D) heat flow structure for power electronics gate drive circuit thermal management is described, which is intended for seamless integration based on power electronics packaging space constraints, while maintaining required electrical isolation.Abstract:
\n Design optimization of a three-dimensional (3D) heat flow structure for power electronics gate drive circuit thermal management is described. Optimization methods are described in the creation of several structural concepts targeted toward simultaneous temperature reduction of multiple gate drive integrated circuit (IC) devices. Each heat flow path concept is intended for seamless integration based on power electronics packaging space constraints, while maintaining required electrical isolation. The design synthesis and fabrication of a select concept prototype is presented along with the development of an experimental test bench for thermal performance characterization. Experimental results indicate a significant 45 ∘C maximum temperature reduction for the gate drive IC devices in a laboratory environment, which translates to an estimated 41 °C maximum temperature reduction under high temperature (∼100 °C) ambient conditions. The technical approach and design strategy are applicable to future wide band-gap (WBG) electronics packaging applications, where enhanced 3D thermal routing is expected to be critical to maximizing volumetric power density.read more
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Journal ArticleDOI
Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging
TL;DR: In this article, thermal metamaterials have been used to guide heat transfer in complex systems and new packaging approaches as related to thermal management of electronics, such as thermal cloaks, concentrators, etc.
Journal ArticleDOI
A study on practical objectives and constraints for heat conduction topology optimization
TL;DR: This article, SIMP-based topology optimization is used to explore several objective functions related to electronics applications to demonstrate clearly the impact of improper objective selection.
Journal ArticleDOI
An optimization case study to design additively manufacturable porous heat sinks based on triply periodic minimal surface (TPMS) lattices
TL;DR: In this article , the thermal performance of TPMS-based heat sinks was analyzed using the topology optimization technique and two unique mapping approaches; namely, averaging and gradient methods, were proposed to transform porous cellular structures to gyroid-based HSs.
Journal ArticleDOI
Detection of Sealant Delamination in Integrated Circuit Package Using Nondestructive Evaluation
TL;DR: In this article, a non-destructive evaluation method for delamination detection in integrated circuit (IC) packages is presented, which allows for quantitative detection of sealant delamination between integrated heat sink (IHS) and substrate, considered a potential failure mechanism in IC packages.
References
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Book
Topology Optimization: Theory, Methods, and Applications
Martin P. Bendsøe,Ole Sigmund +1 more
TL;DR: In this article, the authors proposed a topology optimization by distribution of isotropic material for truss structures with anisotropic materials, based on the topology design of truss structure.
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Introduction to Heat Transfer
TL;DR: In this article, the physical concepts and methodologies of heat and mass transfer are explained for advanced undergraduate engineering majors, using a systematic method for problem solving and discusses the relationship of heat transfer to many important practical applications through examples and problems.
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Introduction To Composite Materials
TL;DR: The combination of materials to form a new material system with enhanced material properties is a well documented historical fact as discussed by the authors, which is why many artisans from the Mediterranean and Far East used a form of composite technology in molding art works which were fabricated by layering cut paper in various sizes for producing desired shapes and contours.
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An Introduction to Composite Materials
Derek Hull,T.W. Clyne +1 more
TL;DR: The authors provides both scientists and engineers with all the information they need to understand composite materials, covering their underlying science and technological usage, including surface coatings, highly porous materials, bio-composites and nano-com composites, as well as thoroughly revised chapters on fibres and matrices.