Proceedings ArticleDOI
A new power module packaging technology for enhanced thermal performance
Burhan Ozmat,Charles Steven Korman,P. McConnelee,M. Kheraluwala,Eladio Clemente Delgado,Raymond Albert Fillion +5 more
- Vol. 2, pp 287-296
TLDR
The Chip on Flex Power Overlay (POL) as mentioned in this paper is a new approach to packaging high performance power devices, which is ideally suited for high heat flux and high performance applications, due to the elimination of bond wires and planar geometry which offers cooling of power devices from top, bottom or both sides of the power module.Abstract:
A new approach to packaging high performance power devices, Chip on Flex Power Overlay (POL) was presented. It was shown that the GE's cost effective POL power packaging technology is ideally suited for high heat flux and high performance applications. This is primarily due to the elimination of bond wires and the planar geometry which offers cooling of power devices from top, bottom or both sides of the power module. It was also shown that a cost effective, scalable high performance integral heat exchanger can maximize the thermal performance of POL technology thereby helping to utilize its full potential. Due to the excellent thermal and electrical performance, low weight, volume, and cost effectiveness GE's revolutionary POL technology sets a new standard for the future of packaging power electronics modules.read more
Citations
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Journal ArticleDOI
Three-dimensional packaging for power semiconductor devices and modules
TL;DR: This paper presents the constructions and some electrical and thermomechanical analyses of four 3-D packaging approaches that have been developed within the Center for Power Electronics Systems-an NSF Engineering Research Center.
Planar Interconnect Technology for Power Module System Integration
TL;DR: SiPLIT(r) as mentioned in this paper is a planar interconnect technology for power modules, which features thick Cu interconnects on a high-reliable insulating film for power semiconductor chip top contacts.
Dissertation
Electrical Integration of SiC Power Devices for High-Power-Density Applications
TL;DR: In this article, a power electronics building block (PEBB) module is developed with discrete SiC MOSFETs, and the effect of DC decoupling capacitors in suppressing the ringing can be explained in a more straightforward way than the traditional time-domain analysis.
Journal ArticleDOI
Reliable and repeatable bonding technology for high temperature automotive power modules for electrified vehicles
TL;DR: In this article, the feasibility of highly reliable and repeatable copper-tin transient liquid phase (Cu-Sn TLP) bonding as applied to die attachment in high temperature operational power modules is presented.
Proceedings ArticleDOI
Development of an ultra-high density Power Chip on Bus (PCoB) module
TL;DR: In this article, a Power Chip on Bus (PCoB) power module approach that reduces parasitic inductance through an integrated power interconnect structure is presented. But, the power chip on bus approach is not suitable for single-sided cooling.
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