Proceedings ArticleDOI
RDL-first Flexible FOWLP Technology with Dielets Embedded in Hydrogel
Noriyuki Takahashi,Yuki Susumago,Sungho Lee,Yuki Miwa,Hisashi Kino,Tetsu Tanaka,Takafumi Fukushima +6 more
- pp 811-816
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TLDR
This work integrates Si LSI and mini-LED dielets in a hydrogel substrate on which fine-feature Au interconnections are formed in wafer-level processing and characterize their electrical properties of the embedded dielets for biomedical applications.Abstract:
A new flexible hybrid electronics (FHE) methodology using advanced RDL-first fan-out wafer-level packaging (FOWLP) technologies with dielets and hydrogel substrates is proposed. Hydrogels mainly consisting of water have excellent biocompatibility, high adaptability, and substance permeability, and they are expected for biomedical applications. In this work, we integrate Si LSI and mini-LED dielets in a hydrogel substrate on which fine-feature Au interconnections are formed in wafer-level processing. We characterize their electrical properties of the embedded dielets for biomedical applications.read more
Citations
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Book ChapterDOI
Fan-Out Wafer/Panel-Level Packaging
TL;DR: First of all, both fan-in wafer/panel-level chip-scale packages (W/PLCSPs or simply WLCSP).
Book ChapterDOI
State-Of-The-Art of Advanced Packaging
TL;DR: In this article , the kinds of advanced packaging are ranked based on their interconnect density and electrical performance, and are grouped into 2D, 2.1D and 3D IC integration.
References
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Journal Article
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