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Proceedings ArticleDOI

The impact of three-dimensional morphological changes and local properties induced by plasma treatment on polyimide films at the interface with some electronic components

TLDR
In this paper, the morphological features and local properties of an semi-alicyclic polyimide film were closely evaluated by atomic force microscopy (AFM), in order to increase their suitability for electronic purposes.
Abstract
The morphological features and local properties of an semi-alicyclic polyimide film were closely evaluated by atomic force microscopy (AFM). These characteristics were optimized by applying high frequency plasma treatment, in order to increase their suitability for electronic purposes. Starting from the surface texture parameters, a deep analysis of the surface topographies at the interface with certain compounds was performed. The action of the plasma species generates a prevalent granular surface morphology, with higher roughness, improved bearing characteristics and minimal surface orientation. In addition, after the plasma treatment, a greater interaction between the AFM silicon tip and the polyimide film occurred, reflecting an increased surface adhesion. The obtained data reveal that the processed semi-alicyclic polyimide exhibits optimal features for microelectronic applications such as silicon/polyimide interfaces for flexible electronics.

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References
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Journal ArticleDOI

The impact of rubbing fabric type on surface roughness and tribological properties of some semi-alicyclic polyimides evaluated from atomic force measurements

TL;DR: In this paper, the morphology of polyimides (PI) prepared from a flexible and alicyclic dianhydride, in combination with aromatic diamines was investigated in detail before and after rubbing with two types of fabric: cotton velvet (CV) and cellulose diacetate velvet (CDV).
Journal ArticleDOI

Statistical analysis on morphology development of some semialicyclic polyimides using atomic force microscopy.

TL;DR: The results provide useful insights in selecting the polyimide structure, which has the optimal morphology, roughness, orientation, bearing properties, or self‐similarity for microelectronics applications such as: substrate for display backplanes, planar technology, microelectronic packaging, etc.
Journal ArticleDOI

Origin of rheological behavior and surface/interfacial properties of some semi-alicyclic polyimides for biomedical applications

TL;DR: In this article, the results of the work of spreading proteins on the hydrophobic polyimide surfaces indicated that albumin is not absorbed preferentially, while fibrinogen is characterized by a higher degree of adhesion on the surfaces, and also that selective adsorption of plasma proteins modifies blood compatibility.
Journal ArticleDOI

Structural and dielectric properties of some epiclon-based polyimide films

TL;DR: In this paper, surface and electrical properties of two flexible and cross-linked epiclon based polyimide films were investigated, and the electrical conductance and resistivity characteristics of these polymers recommend them as good insulators for dielectric layers in microelectronic applications.
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