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Relationship between nanoscale roughness and ion-damaged layer in argon plasma exposed polystyrene films

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TLDR
In this article, the authors investigated the question of a possible relationship between the formation of nanoscale roughening and the simultaneous introduction of a nanometer-thick, densified surface layer that is formed on polymers due to plasma damage.
Abstract
The uncontrolled development of nanoscale roughness during plasma exposure of polymer surfaces is a major issue in the field of semiconductor processing. In this paper, we investigated the question of a possible relationship between the formation of nanoscale roughening and the simultaneous introduction of a nanometer-thick, densified surface layer that is formed on polymers due to plasma damage. Polystyrene films were exposed to an Ar discharge in an inductively coupled plasma reactor with controllable substrate bias and the properties of the modified surface layer were changed by varying the maximum Ar+ ion energy. The modified layer thickness, chemical, and mechanical properties were obtained using real-time in situ ellipsometry, x-ray photoelectron spectroscopy, and modeled using molecular dynamics simulation. The surface roughness after plasma exposure was measured using atomic force microscopy, yielding the equilibrium dominant wavelength λ and amplitude A of surface roughness. The comparison of mea...

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Citations
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Journal ArticleDOI

Surface modification of polymers by plasma treatments for the enhancement of biocompatibility and controlled drug release

TL;DR: The fabrication and the characterization of polymers by several types of plasma treatments are reviewed, followed by the introduction of their applications to the materials in drug delivery systems and tissue engineering.
Journal ArticleDOI

Plasma-polymer interactions: A review of progress in understanding polymer resist mask durability during plasma etching for nanoscale fabrication

TL;DR: In this paper, an organic film-based image is produced, which is subsequently transferred by plasma etching techniques into underlying films/substrates to produce nanoscale materials templates.
Journal ArticleDOI

Surface Roughening of Polystyrene and Poly(methyl methacrylate) in Ar/O2 Plasma Etching

TL;DR: In this article, the role of cross-linking in surface roughness was examined during the etching of polystyrene-block-poly(methyl methacrylate) (PS-b-PMMA) diblock copolymer masks.
References
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Journal ArticleDOI

Diamond-like amorphous carbon

TL;DR: In this paper, the authors describe the deposition methods, deposition mechanisms, characterisation methods, electronic structure, gap states, defects, doping, luminescence, field emission, mechanical properties and some applications of diamond-like carbon.
Book

Practical Surface Analysis

TL;DR: In this paper, the authors used the carbon C 1s peak at 285 eV as a reference for charge correction in XPS analyses of samples prepared outside the high vacuum chamber relatively thick carbon layers are formed on the surfaces.
Book

Polymer Data Handbook

James E. Mark
TL;DR: In this article, the authors present key data on approximately 200 important polymers currently in industrial use or under study in industrial or academic research, including platics, artificial fibers, rubber, cellulose, and many other materials.
Journal ArticleDOI

Spontaneous formation of ordered structures in thin films of metals supported on an elastomeric polymer

TL;DR: In this paper, the authors describe the appearance of complex, ordered structures induced by the buckling of thin metal films owing to thermal contraction of an underlying substrate, and account qualitatively for the size and form of the patterned features in terms of the nonuniform stresses developed in the film near steps on the polymer substrate.
Journal ArticleDOI

A buckling-based metrology for measuring the elastic moduli of polymeric thin films

TL;DR: An elegant, efficient measurement method that yields the elastic moduli of nanoscale polymer films in a rapid and quantitative manner without the need for expensive equipment or material-specific modelling is introduced.
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