Thermal modeling of BOX/DTI enclosed power devices with Green's function approach

TLDR: In this paper, a computationally efficient geometry dependent thermal model is presented that avoids the time and cost penalty of numerical thermal simulations and utilizes the Green's function approach in combination with mixed boundary conditions.

Abstract: Accurate thermal models for power devices are crucial due to the simultaneous introduction of deep trenches (DTI) and silicon on insulator (SOI) technology. A computationally efficient geometry dependent thermal model is presented that avoids the time and cost penalty of numerical thermal simulations and utilizes the Green's function approach in combination with mixed boundary conditions. The derived model is accurate (relative temperature error < 10%) and valid for dimensions ranging between 5µm and 200µm. The new model allows for on-the-fly calculations of the thermal resistance R th as well as thermal coupling coefficients for multi-finger devices, enabling predictive modeling and concurrent engineering.