Journal ArticleDOI
Thermally driven reliability issues in microelectronic systems: status-quo and challenges
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TLDR
To meet the needs of future microelectronics and microsystems, there needs a paradigm shift in the approach to system reliability, and this paper discusses several reasons for these facts and offers a perspective for future improvements.About:
This article is published in Microelectronics Reliability.The article was published on 2003-12-01. It has received 62 citations till now.read more
Citations
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Journal ArticleDOI
Light emitting diodes reliability review
Moon-Hwan Chang,Diganta Das,Prabhakar V. Varde,Prabhakar V. Varde,Michael Pecht,Michael Pecht +5 more
TL;DR: This paper provides the groundwork for an understanding of the reliability issues of LEDs across the supply chain and identifies the relationships between failure causes and their associated mechanisms, issues in thermal standardization, and critical areas of investigation and development in LED technology and reliability.
Proceedings ArticleDOI
Temperature aware task scheduling in MPSoCs
TL;DR: This work design and evaluate OS-level dynamic scheduling policies with negligible performance overhead, and shows that, using simple to implement policies that make decisions based on temperature measurements, better temporal and spatial thermal profiles can be achieved in comparison to state-of-art schedulers.
Proceedings ArticleDOI
Dynamic thermal management in 3D multicore architectures
TL;DR: This work first investigates how the existing thermal management, power management and job scheduling policies affect the thermal behavior in 3D chips, and proposes a dynamic thermally-aware job scheduling technique for 3D systems to reduce the thermal problems at very low performance cost.
Journal ArticleDOI
Survey of Energy-Cognizant Scheduling Techniques
TL;DR: How the energy-cognizant scheduler's role has been extended beyond simple energy minimization to also include related issues like the avoidance of negative thermal effects as well as addressing asymmetric multicore architectures is explored.
Journal ArticleDOI
Static and Dynamic Temperature-Aware Scheduling for Multiprocessor SoCs
TL;DR: In this paper, the authors explore the benefits of temperature-aware task scheduling for multiprocessor system-on-a-chip (MPSoC) and evaluate their techniques using workload characteristics collected from a real system by Sun's Continuous System Telemetry.
References
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Book
Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach
TL;DR: In this article, the authors present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level.
Journal ArticleDOI
The conceivable accuracy of experimental and numerical thermal analyses of electronic systems
TL;DR: 'every' topic associated with a comparison between numerical and experimental results that is based on first principles, not on fitting parameters until the two results match is discussed.
Journal ArticleDOI
Enhanced electronic system reliability - challenges for temperature prediction
TL;DR: In this article, the role of thermal design and reliability qualification is discussed in context of current industrial needs for short design cycles and rapid implementation of new technologies, and two multi-company projects targeting the improvement of reliability through better temperature-related information are described.
Proceedings ArticleDOI
The European project PROFIT: prediction of temperature gradients influencing the quality of electronic products
TL;DR: In this paper, a new European project, called PROFIT, commenced as a kind of successor to the successfully finished EC-funded DELPHI, SEED and THERMINIC projects, aimed at creating methods and tools that enable sufficiently accurate measurement and prediction of temperature gradients in time and space.
Journal ArticleDOI
An avionics guide to uprating of electronic parts
TL;DR: In this article, the authors present an overview of the methods for uprating electronic parts including definitions and descriptions, as well as a guidebook consisting of methods for the uprating process.