Journal ArticleDOI
Three-Dimensional Paddle Shift Modeling for IC Packaging
Chien Chang Pei,Sheng-Jye Hwang +1 more
About:
This article is published in Journal of Electronic Packaging.The article was published on 2005-09-01. It has received 22 citations till now. The article focuses on the topics: Paddle.read more
Citations
More filters
Journal ArticleDOI
Investigation of the fluid/structure interaction phenomenon in IC packaging
TL;DR: The virtual modelling technique was proven to be excellent in handling the visualisation of FSI phenomenon in the actual package due to limitations of package size, available equipment, and the high cost of the experimental setup.
Journal ArticleDOI
Analysis of encapsulation process in 3D stacked chips with different microbump array
TL;DR: In this paper, the authors presented the study of encapsulation process in 3D stacked chips with different microbump arrays, and validated with numerical simulation done in FLUENT 6.3.
Journal ArticleDOI
Thermal Fluid-Structure Interaction in the Effects of Pin-Through-Hole Diameter during Wave Soldering
M. S. Abdul Aziz,Mohd Zulkifly Abdullah,C. Y. Khor,Z. M. Fairuz,Anam Iqbal,M. Mazlan,Mohd Sukhairi Mat Rasat +6 more
TL;DR: In this article, an effective simulation approach is introduced to study the thermal fluid-structure interaction (thermal FSI) on the effect of pin-through-hole diameter on the wave soldering.
Journal ArticleDOI
Fluid/Structure Interaction Analysis of the Effects of Solder Bump Shapes and Input/Output Counts on Moulded Packaging
TL;DR: In this paper, a fluid/structure interaction (FSI) analysis of the effects of solder bump shapes and input/output (I/O) counts on molded packaging is presented.
Journal ArticleDOI
Effect of stacking chips and inlet positions on void formation in the encapsulation of 3D stacked flip-chip package
TL;DR: In this paper, the authors investigated the effects of increasing the number of stacking chips and applying three types of inlet positions to the void formation in three-dimensional (3D) stacked flip-chip packaging.
References
More filters
Journal ArticleDOI
Numerical simulation of mold filling in injection molding using a three‐dimensional finite volume approach
Rong-yeu Chang,Wen-hsien Yang +1 more
TL;DR: In this article, an implicit finite volume approach is presented to simulate the three-dimensional mold filling problems encountered during the injection molding, where the collocated finite volume method and the SIMPLE segregated algorithm are used to discretize and solve the Navier-Stokes equation.