Journal ArticleDOI
Tracing the thermal behavior of ICs
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TLDR
Today's increased power and packaging densities demand designers' attention to the effects of heat on ICs, and the concept and techniques of design for thermal testability are reviewed.Abstract:
Today's increased power and packaging densities demand designers' attention to the effects of heat on ICs. The authors review thermal and electrothermal simulation and measurement methods, thermal package characterization, and the concept and techniques of design for thermal testability.read more
Citations
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Journal ArticleDOI
A scalable thermal model for trench isolated bipolar devices
TL;DR: In this paper, a physical model is presented to predict the thermal resistance of a bipolar transistor fabricated in a trench isolated technology, and the model is applied to devices with a variety of geometries in two trench isolated technologies.
Journal ArticleDOI
Light-Weight On-Chip Monitoring Network for Dynamic Adaptation and Calibration
TL;DR: This paper presents a new monitoring network paradigm able to perform an early prioritization of the information by introducing a new hierarchy level, the threshing level, and proposes a time-domain signaling scheme over a single-wire that minimizes the network switching activity as well as the routing requirements.
Proceedings ArticleDOI
PCB Testing Using Infrared Thermal Signatures
TL;DR: A printed circuit board (PCB) testing method using infrared thermal signatures is presented and the classification system is a feed-forward neural network that learns and classifies the information achieved from the infrared image.
Proceedings ArticleDOI
A Power Benchmark Experiment for Battery-powered Devices
Dacian Tudor,Marius Marcu +1 more
TL;DR: A new type of benchmark that can be used to profile power consumption of battery-powered devices running different applications and its application depends on their battery lifetime is proposed.
Proceedings ArticleDOI
Power Profile Evaluation of Battery-Powered Mobile Applications
TL;DR: It is presented in this paper how power benchmarks can be used to characterize power consumption of battery-powered devices running different applications.
References
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Journal ArticleDOI
CMOS sensors for on-line thermal monitoring of VLSI circuits
TL;DR: A new family of temperature sensors will be presented, developed by the authors especially for the purpose of thermal monitoring of VLSI chips, characterized by the very low silicon area and the low power consumption.
Journal ArticleDOI
Electrothermal simulation of integrated circuits
Sang-soo Lee,David J. Allstot +1 more
TL;DR: In this paper, the incomplete Choleski conjugate gradient (ICCG) method was used to simulate the thermal characteristics of integrated circuits and transient electrothermal performance using asymptotic waveform evaluation (AWE).
CMOS sensors for on-line thermal monitoring of VLSI circuits
TL;DR: In this article, a new family of temperature sensors for the purpose of thermal monitoring of VLSI chips is presented, characterized by the very low silicon area of about 0.003-0.02 mm 2 and the low power consumption (200 μW).
Proceedings ArticleDOI
A novel approach for the thermal characterization of electronic parts
TL;DR: A novel approach is introduced, based on the derivation of a simple resistance network starting from a detailed model using optimization techniques, and it is demonstrated that it is possible to create a compact model comprising asimple resistance network, representing the detailed model to a high accuracy which is independent of the boundary conditions.