Journal ArticleDOI
Tracing the thermal behavior of ICs
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TLDR
Today's increased power and packaging densities demand designers' attention to the effects of heat on ICs, and the concept and techniques of design for thermal testability are reviewed.Abstract:
Today's increased power and packaging densities demand designers' attention to the effects of heat on ICs. The authors review thermal and electrothermal simulation and measurement methods, thermal package characterization, and the concept and techniques of design for thermal testability.read more
Citations
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Thermal profiling of homogeneous multi-core processors using sensor mini-networks
TL;DR: This work focuses on a sensor placement mechanism and an on-chip sensor mini-network to combine temperatures from multiple sensors to determine the full thermal profile of a chip.
Journal ArticleDOI
Monitoring of power dissipated in microelectronic structures
Piotr Dziurdzia,Andrzej Kos +1 more
TL;DR: The paper presents the principle and theoretical considerations of the mean value power monitoring in VLSI systems necessary for proper driving of the active heat sink.
Proceedings ArticleDOI
Windows XP Issues for Real-Time Temperature Monitoring
TL;DR: A number of three solutions for thermal sensors connecting to PC's interfaces are presented, addressing the problem of temperature monitoring using a non real-time operating system, like Windows.
Journal ArticleDOI
Power-thermal profiling of software applications
TL;DR: The work presented in this paper evaluates the relation between power consumption and thermal response of CPU cores when different software applications are executed and whether it is feasible to implement thermal-aware software applications.
References
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Journal ArticleDOI
CMOS sensors for on-line thermal monitoring of VLSI circuits
TL;DR: A new family of temperature sensors will be presented, developed by the authors especially for the purpose of thermal monitoring of VLSI chips, characterized by the very low silicon area and the low power consumption.
Journal ArticleDOI
Electrothermal simulation of integrated circuits
Sang-soo Lee,David J. Allstot +1 more
TL;DR: In this paper, the incomplete Choleski conjugate gradient (ICCG) method was used to simulate the thermal characteristics of integrated circuits and transient electrothermal performance using asymptotic waveform evaluation (AWE).
CMOS sensors for on-line thermal monitoring of VLSI circuits
TL;DR: In this article, a new family of temperature sensors for the purpose of thermal monitoring of VLSI chips is presented, characterized by the very low silicon area of about 0.003-0.02 mm 2 and the low power consumption (200 μW).
Proceedings ArticleDOI
A novel approach for the thermal characterization of electronic parts
TL;DR: A novel approach is introduced, based on the derivation of a simple resistance network starting from a detailed model using optimization techniques, and it is demonstrated that it is possible to create a compact model comprising asimple resistance network, representing the detailed model to a high accuracy which is independent of the boundary conditions.