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Journal ArticleDOI

Ultrashort-pulse laser machining of dielectric materials

TLDR
In this article, the authors show that high precision machining of all dielectrics (oxides, fluorides, explosives, teeth, glasses, ceramics, SiC, etc.) with no thermal shock or distortion of the remaining material by this mechanism is described.
Abstract
There is a strong deviation from the usual τ1/2 scaling of laser damage fluence for pulses below 10 ps in dielectric materials. This behavior is a result of the transition from a thermally dominated damage mechanism to one dominated by plasma formation on a time scale too short for significant energy transfer to the lattice. This new mechanism of damage (material removal) is accompanied by a qualitative change in the morphology of the interaction site and essentially no collateral damage. High precision machining of all dielectrics (oxides, fluorides, explosives, teeth, glasses, ceramics, SiC, etc.) with no thermal shock or distortion of the remaining material by this mechanism is described.

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Citations
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Journal ArticleDOI

Reduction of damage threshold in dielectric materials induced by negatively chirped laser pulses

TL;DR: In this paper, the threshold fluence for laser induced damage in wide band gap dielectric materials, fused silica and MgF2, is observed to be lower by up to 20% for negatively (down) chirped pulses than for positively (up) chirsped, at pulse durations ranging from 60 fs to 1 ps.

Deterministic processing of alumina with ultra-short laser pulses

TL;DR: In this article, a model for the machining of linear trenches based on experimental data in alumina is presented, which predicts and matches observed trench geometry, and is then used to predict optimal process parameters for linear trenches for maximal material removal rate for a given laser.
Journal ArticleDOI

Ultrafast laser micromachining of thermal sprayed coatings for microheaters : Design, fabrication and characterization

TL;DR: In this article, an ultrafast laser (pulse duration < 1 ps) direct-write technique for rapid prototyping and manufacturing of embedded microheater structures on thermal sprayed NiCr (80 wt%/20 wt%) alloy coatings is presented.
Patent

Methods and apparatuses for laser processing materials

TL;DR: In this paper, a method for laser processing a transparent material is described, where the laser beam may be incident on a side of the transparent material opposite the carrier and the carrier may include a support base and a laser disruption element.
Journal ArticleDOI

Short-Time Thermal Effects on Thermomechanical Response Caused By Pulsed Lasers

TL;DR: In this article, an ultrafast thermoelasticity model is proposed to analyze the heat transport and thermomechanical phenomena in metal films heated by femtosecond laser pulses.
References
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Tunnel ionization of complex atoms and of atomic ions in an altemating electromagnetic field

M. V. Ammosov
TL;DR: In this article, an expression for the probability of tunnel ionization in an alternating field, of a complex atom and of an atomic ion that are in an arbitrary state, was derived in the quasiclassical approximation n* $1.
Journal ArticleDOI

Nanosecond-to-femtosecond laser-induced breakdown in dielectrics

TL;DR: A decreasing threshold fluence is found associated with a gradual transition from the long-pulse, thermally dominated regime to an ablative regime dominated by collisional and multiphoton ionization, and plasma formation.
Book

Quantum Processes in Semiconductors

TL;DR: In this paper, the energy and momentum conservation of phonon-impurity coupling in the diamond lattice is discussed. But the authors do not consider the effect of photo-ionization on photo-deionization of a hydrogenic acceptor.
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