scispace - formally typeset
Journal ArticleDOI

Ultrashort-pulse laser machining of dielectric materials

TLDR
In this article, the authors show that high precision machining of all dielectrics (oxides, fluorides, explosives, teeth, glasses, ceramics, SiC, etc.) with no thermal shock or distortion of the remaining material by this mechanism is described.
Abstract
There is a strong deviation from the usual τ1/2 scaling of laser damage fluence for pulses below 10 ps in dielectric materials. This behavior is a result of the transition from a thermally dominated damage mechanism to one dominated by plasma formation on a time scale too short for significant energy transfer to the lattice. This new mechanism of damage (material removal) is accompanied by a qualitative change in the morphology of the interaction site and essentially no collateral damage. High precision machining of all dielectrics (oxides, fluorides, explosives, teeth, glasses, ceramics, SiC, etc.) with no thermal shock or distortion of the remaining material by this mechanism is described.

read more

Citations
More filters
Patent

Edge chamfering methods

TL;DR: In this paper, two general methods to produce chamfers on glass substrates are described, the first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser to create perforations within the glass; followed by an ion exchange.
Journal ArticleDOI

Control of material removal of fused silica with single pulses of few optical cycles to sub-picosecond duration

TL;DR: In this article, surface ablation of a dielectric material (fused silica) by single femtosecond pulses is studied as a function of pulse duration and applied fluence.
Journal ArticleDOI

Silver nano-entities through ultrafast double ablation in aqueous media for surface enhanced Raman scattering and photonics applications

TL;DR: In this paper, the effects of multiple/double/single ablation on silver substrates via surface morphology studies along with average size distribution of Ag NPs were investigated using ∼2 ps laser pulses.
Journal ArticleDOI

Toward determinism in surface damaging of dielectrics using few-cycle laser pulses

TL;DR: In this article, the authors introduced a quantitative measurement of the determinism of laser-induced damaging at the surface of a dielectric material, e.g., fused silica, using laser pulses ranging from 7 to 300 fs.
Journal ArticleDOI

Microscopic mechanisms of ablation and micromachining of dielectrics by using femtosecond lasers

TL;DR: In this article, the authors report measurements of damage threshold and ablation depth for SiO2 and CaF2 irradiated under lasers at wavelengths of 800 and 400 nm for duration of 45-800 fs.
References
More filters

Tunnel ionization of complex atoms and of atomic ions in an altemating electromagnetic field

M. V. Ammosov
TL;DR: In this article, an expression for the probability of tunnel ionization in an alternating field, of a complex atom and of an atomic ion that are in an arbitrary state, was derived in the quasiclassical approximation n* $1.
Journal ArticleDOI

Nanosecond-to-femtosecond laser-induced breakdown in dielectrics

TL;DR: A decreasing threshold fluence is found associated with a gradual transition from the long-pulse, thermally dominated regime to an ablative regime dominated by collisional and multiphoton ionization, and plasma formation.
Book

Quantum Processes in Semiconductors

TL;DR: In this paper, the energy and momentum conservation of phonon-impurity coupling in the diamond lattice is discussed. But the authors do not consider the effect of photo-ionization on photo-deionization of a hydrogenic acceptor.
Related Papers (5)