There is, I think, something ethereal about i —the square root of minus one. I remember first hearing about it at school. It seemed an odd beast at that time—an intruder hovering on the edge of reality.

Usually familiarity dulls this sense of the bizarre, but in the case of i it was the reverse: over the years the sense of its surreal nature intensified. It seemed that it was impossible to write mathematics that described the real world in …

I and i

다중혈관 관상동맥 환자에서 y-문합을 이용하여 양쪽 내흉동맥만을 사용한 우회술의 조기 성적

[신간의 별자리x] 우리/미술, 그리고 ‘슬픔의 박물관’

International Technology Roadmap for Semiconductors 2003の要求清浄度について － シリコンウエハ表面と雰囲気環境に要求される清浄度, 分析方法の現状について －

Monte Carlo simulations have been widely used by microscopists for the last few decades. In the beginning it was a tedious and slow process, requiring a high level of computer skills from users and long computational times. Recent progress in the microelectronics industry now provides researchers with affordable desktop computers with clock rates greater than 3 GHz. With this type of computing power routinely available, Monte Carlo simulation is no longer an exclusive or long (overnight) process. The aim of this paper is to present a new user-friendly simulation program based on the earlier CASINO Monte Carlo program. The intent of this software is to assist scanning electron microscope users in interpretation of imaging and microanalysis and also with more advanced procedures including electron-beam lithography. This version uses a new architecture that provides results twice as quickly. This program is freely available to the scientific community and can be downloaded from the website: (www.gel.usherb.ca/casino).

/pdf/casino-v2-42-a-fast-and-easy-to-use-modeling-tool-for-4x80ysvonj.pdf

CASINO V2.42: a fast and easy-to-use modeling tool for scanning electron microscopy and microanalysis users.

The interest in very-large-scale integration technology combined with market pressure to reduce materials and process costs introduce new packaging yield and reliability challenges. The use of organic substrates in flip-chip packages, rather than ceramics, led to thermal and moisture related issues. The organic laminate coefficient of thermal expansion substantially differs from the chip one, potentially leading to interfacial delamination and interconnect rupture. Moreover, organic substrates are permeable to water, potentially leading to electrochemical migration, corrosion of alloys, delamination and short-circuits. Thus temperature and moisture variation can have baneful consequences on flip-chip packages. Here, the internal module temperature and moisture quantities of a flip-chip package are measured using microscopic embedded carbon nanotube-based sensors. Those sensors are fabricated near interconnects and are positioned to provide spatial and real-time mapping of moisture and temperature in the package, for a better interconnect reliability study or package aging monitoring.

Smart Packaging - Microscopic Temperature and Moisture Sensors Embedded in a Flip-Chip Package

The present invention relates to a method of producing a structure of etch-resistant polymer on a substrate. A layer of sterol capable of polymerizing to form this structure is first deposited on a face of the substrate. Then, a first region of the layer of sterol is exposed to an electron beam to locally polymerize this layer and form the structure of etch-resistant polymer. A second region of the layer of sterol that has not been exposed to the electron beam is removed to leave on the face of the substrate only the structure of etch-resistant polymer. Finally, a region of the face of the substrate not covered by the structure of etch-resistant polymer can be etched away, and the structure of etch-resistant polymer removed following this etching.

Method of producing an etch-resistant polymer structure using electron beam lithography

In this paper, the effect of fast secondary electrons (FSE), which result from inelastic scattering of incident electrons, on the characterization of materials in the scanning electron microscope are investigated with the aid of Monte Carlo simulations. The effect of FSE on x-ray microanalysis of light elements is investigated. A full description of the Monte Carlo simulations of FSE in solids is given.

Dominique Drouin

Papers

Smart Packaging - Microscopic Temperature and Moisture Sensors Embedded in a Flip-Chip Package

Method of producing an etch-resistant polymer structure using electron beam lithography

The effect of fast secondary electrons on x-ray microanalysis in the scanning electron microscope.

Effect of sintering germanium epilayers on dislocation dynamics: From theory to experimental observation

Voided Ge/Si Platform to Integrate III-V Materials on Si