scispace - formally typeset
F

Franz Kreupl

Researcher at Technische Universität München

Publications -  269
Citations -  6240

Franz Kreupl is an academic researcher from Technische Universität München. The author has contributed to research in topics: Carbon nanotube & Layer (electronics). The author has an hindex of 40, co-authored 269 publications receiving 5986 citations. Previous affiliations of Franz Kreupl include Infineon Technologies & SanDisk.

Papers
More filters
Journal ArticleDOI

Electrochemical functionalization of multi-walled carbon nanotubes for solvation and purification

TL;DR: In this article, the evolution of the halogens chlorine or bromine on an anode made from a foil of carbon nanotubes couples halogen atoms to the nanotube lattice.
Journal ArticleDOI

Sub-20 nm short channel carbon nanotube transistors

TL;DR: Carbon nanotube field effect transistors with sub-20 nm long channels and on/off current ratios of >10(6) were demonstrated in this paper, where individual single-walled carbon nanotubes with diameters ranging from 0.7 to 1.1 nm grown from structured catalytic islands using chemical vapor deposition at 700 degrees C form the channels.
Journal ArticleDOI

Sub 20 nm Short Channel Carbon Nanotube Transistors

TL;DR: Carbon nanotube field-effect transistors with sub-20 nm long channels and on/off current ratios of >10(6) are demonstrated and display on-currents in excess of 15 microA for drain-source biases of only 0.4 V.
Journal ArticleDOI

Carbon nanotubes for microelectronics: status and future prospects

TL;DR: In this article, a simulation of an ideal vertical carbon nanotube field effect transistors (CNTFETs) is presented and compared with the requirements of the ITRS roadmap.
Patent

Electronic component comprising an electrically conductive connection consisting of carbon nanotubes and a method for producing the same

TL;DR: In this paper, an electronic component comprising of a first conductive layer, a non-conductive layer and a second conductive one is described. And a hole is etched through the non-condense layer to link the first and second conductives in a conductive manner.