Department of Materials Science, University of Patras, 26504 Rio Patras, Greece, Theoretical and Physical Chemistry Institute, National Hellenic Research Foundation, 48 Vass. Constantinou Avenue, 116 35 Athens, Greece, Institut de Biologie Moleculaire et Cellulaire, UPR9021 CNRS, Immunologie et Chimie Therapeutiques, 67084 Strasbourg, France, and Dipartimento di Scienze Farmaceutiche, Universita di Trieste, Piazzale Europa 1, 34127 Trieste, Italy

Chemistry of Carbon Nanotubes

Carbon nanotubes (CNTs) hold the promise of delivering exceptional mechanical properties and multi-functional characteristics. Ever-increasing interest in applying CNTs in many different fields has led to continued efforts to develop dispersion and functionalization techniques. To employ CNTs as effective reinforcement in polymer nanocomposites, proper dispersion and appropriate interfacial adhesion between the CNTs and polymer matrix have to be guaranteed. This paper reviews the current understanding of CNTs and CNT/polymer nanocomposites with two particular topics: (i) the principles and techniques for CNT dispersion and functionalization and (ii) the effects of CNT dispersion and functionalization on the properties of CNT/polymer nanocomposites. The fabrication techniques and potential applications of CNT/polymer nanocomposites are also highlighted.

Dispersion and functionalization of carbon nanotubes for polymer-based nanocomposites: a review

The semiconductor industry has been able to improve the performance of electronic systems for more than four decades by making ever-smaller devices. However, this approach will soon encounter both scientific and technical limits, which is why the industry is exploring a number of alternative device technologies. Here we review the progress that has been made with carbon nanotubes and, more recently, graphene layers and nanoribbons. Field-effect transistors based on semiconductor nanotubes and graphene nanoribbons have already been demonstrated, and metallic nanotubes could be used as high-performance interconnects. Moreover, owing to the excellent optical properties of nanotubes it could be possible to make both electronic and optoelectronic devices from the same material.

Carbon-based electronics.

An object is to provide a semiconductor device of which a manufacturing process is not complicated and by which cost can be suppressed, by forming a thin film transistor using an oxide semiconductor film typified by zinc oxide, and a manufacturing method thereof. For the semiconductor device, a gate electrode is formed over a substrate; a gate insulating film is formed covering the gate electrode; an oxide semiconductor film is formed over the gate insulating film; and a first conductive film and a second conductive film are formed over the oxide semiconductor film. The oxide semiconductor film has at least a crystallized region in a channel region.

Semiconductor device, and manufacturing method thereof

The present invention provides device components geometries and fabrication strategies for enhancing the electronic performance of electronic devices based on thin films of randomly oriented or partially aligned semiconducting nanotubes. In certain aspects, devices and methods of the present invention incorporate a patterned layer of randomly oriented or partially aligned carbon nanotubes, such as one or more interconnected SWNT networks, providing a semiconductor channel exhibiting improved electronic properties relative to conventional nanotubes-based electronic systems.

Medium scale carbon nanotube thin film integrated circuits on flexible plastic substrates

An integrated circuit and method for manufacturing an integrated circuit are described. In one embodiment, the integrated circuit includes a memory cell including a resistivity changing memory element and a carbon diode electrically coupled to the resistivity changing memory element.

Carbon diode array for resistivity changing memories

A memory cell includes a first electrode comprising a nanowire, a second electrode, and phase-change material between the first electrode and the second electrode.

Phase change memory cell having nanowire electrode

Silicon to nickel disilicide axial nanowire (NW) heterostructures have been fabricated and investigated extensively. To this end, intrinsic Si-NWs were grown by chemical vapor deposition using Au as the catalyst. The Si-NWs were contacted with Ni reservoirs so that upon annealing Ni diffused axially into the NWs. Single-crystalline NiSi 2 NW segments were formed at the diffusion path of Ni as proven by high-resolution transmission electron microscopy images. Further, the axial NiSi 2 to Si interfaces showed a sharpness of a couple of nanometers. Fully silicided NiSi 2 -NWs had maximal resistivities of 98 μΩ cm and conducted current densities of up to 205 MA/cm 2 before breakdown. Controlled silicidation from both NW ends gave NiSi 2 /Si/NiSi 2 axial NW heterostructures, which were implemented to fabricate Schottky contact field effect transistors (FET). The n ++ -substrate was used as a common back gate and the Si to NiSi 2 interfaces formed the Schottky source- and drain-(S/D) contacts to the active region. These Si-NW SB-FETs exhibited p-type behavior, and current densities in the on state of up to 0.8 MA/cm 2 for 1 V bias, the drain current could be modulated over a range of 10 7 . Moreover, the use of thin gate dielectrics enabled inverse subthreshold slopes as low as 110 mV/dec. These data show an efficient gate control over the devices by only using a back gate, due to an enhanced gate field coupling to the tip-like S/D-Schottky contacts.

Silicon to nickel‐silicide axial nanowire heterostructures for high performance electronics

A carbon-nanotube transistor has been made that performs better than the best conventional silicon analogues. The result propels these devices to the forefront of future microchip technologies.

Electronics: Carbon nanotubes finally deliver.

We report on a novel spin torque select MRAM with perpendicular anisotropy (P-ST-MRAM). The P-ST concept offers superior scalability performance at the 28 nm technology node compared to the conventional in-plane spin torque MRAM (I-ST-MRAM). The critical programming currents (~ 30 muA) are low, allowing a cell layout as small as 6 F2. In addition, data retention is significantly better for P-ST enabling a non-volatile, high density product for the 28 nm node. Estimations on write performance promise high write endurance and high write speed. Circuit simulations with improved read circuit demonstrate array read access time ~ 30 ns at sensing currents ~ 10 muA.

Franz Kreupl

Papers

Carbon diode array for resistivity changing memories

Phase change memory cell having nanowire electrode

Silicon to nickel‐silicide axial nanowire heterostructures for high performance electronics

Electronics: Carbon nanotubes finally deliver.

A Perpendicular Spin Torque Switching based MRAM for the 28 nm Technology Node