Journal ArticleDOI
Power bus decoupling on multilayer printed circuit boards
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TLDR
In this article, a decoupling strategy for multilayer boards must account for the low inductance and relatively high capacitance of the power bus, which is not appropriate for one-sided or two-sided printed circuit boards.Abstract:
Guidelines for the selection and placement of decoupling capacitors that work well for one-sided or two-sided printed circuit boards are not appropriate for multilayer boards with power and ground planes. Boards without internal planes take advantage of the power bus inductance to help decouple components at the higher frequencies. An effective decoupling strategy for multilayer boards must account for the low inductance and relatively high capacitance of the power bus. >read more
Citations
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Journal ArticleDOI
Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG Isolation
TL;DR: In this article, the authors reviewed possible solutions based on decoupling or isolation for suppressing power distribution network (PDN) noise on package or printed circuit board (PCB) levels.
Journal ArticleDOI
Study of the ground bounce caused by power plane resonances
TL;DR: In this article, the effect of power plane resonances on the ground bounce of the system by performing finite-difference time-domain (FDTD) simulations is investigated. And two methods to prevent this ground bounce effect are investigated.
Journal ArticleDOI
Electromagnetic interference (EMI) of system-on-package (SOP)
TL;DR: In this paper, the authors discuss the design and development of system-on-package (SOP) integrated high-performance digital LSIs and for radio frequency (RF) and analog circuits.
Journal ArticleDOI
Quantifying SMT decoupling capacitor placement in dc power-bus design for multilayer PCBs
Jun Fan,James L. Drewniak,James L. Knighten,N.W. Smith,Antonio Orlandi,T.P. Van Doren,Todd H. Hubing,Richard E. DuBroff +7 more
TL;DR: In this article, the authors investigated the effect of placing SMT capacitors in proximity to ICs in multilayer PCB designs and demonstrated that local decoupling can provide high-frequency benefits for certain PCB geometries through mutual inductive coupling between closely spaced vias.
Patent
Circuit and method for suppression of electromagnetic coupling and switching noise in multilayer printed circuit boards
TL;DR: In this article, a lower conductive plate (3422) at a distance tl from the array of conductive coplanar patches and conductive rods (3126) extending from respective patches to the lower plate was used to suppress noise and electromagnetic coupling.
References
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Book
Noise Reduction Techniques in Electronic Systems
TL;DR: In this paper, the authors present new chapters on controlling the emission from electronic systems, especially digital systems, and on low-cost techniques for providing electromagnetic compatibility (EMC) for consumer products sold in a competitive market.
Journal ArticleDOI
Effectiveness of multiple decoupling capacitors
TL;DR: In this paper, the performance of parallel combination of large-value and small-value capacitors to increase the frequency coverage of either one and overcome the effect of lead inductance is examined.
Journal ArticleDOI
An investigation of delta-I noise on integrated circuits
TL;DR: In this article, the authors show that the physics of the delta-I noise is more complex and that it is related to wave propagation effects, and that the inductive effects are important only for slower transients.
Proceedings ArticleDOI
Decoupling capacitor effects on switching noise
TL;DR: In this article, the decoupling capacitor efficiency in reducing the power supply differential switching noise of the multichip-module (MCM) package structure employed in the IBM ES/9000 system is described.