O
O. Rayssac
Researcher at Soitec
Publications - 5
Citations - 143
O. Rayssac is an academic researcher from Soitec. The author has contributed to research in topics: Diffusion (business) & Wire bonding. The author has an hindex of 3, co-authored 5 publications receiving 138 citations.
Papers
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Journal ArticleDOI
The generic nature of SmartCut process for thin film transfer
B. Aspar,Hubert Moriceau,E. Jalaguier,C. Lagahe,A. Soubie,Beatrice Biasse,A. M. Papon,Alain Claverie,Jérémie Grisolia,Gérard Benassayag,Fabrice Letertre,O. Rayssac,T. Barge,Christophe Maleville,Bruno Ghyselen +14 more
TL;DR: In this paper, a specific case of thermally-induced splitting is investigated, where the splitting kinetics are controlled by hydrogen diffusion. And the latest results concerning new structures are presented.
Journal ArticleDOI
Spreading dynamics of water droplets
TL;DR: It is shown that, for situations close to complete wetting, the radius evolution with time can be described using a power law with a nonstandard exponent of 1/7, which is consistent with the slow dynamics observed for larger contact angles.
Journal ArticleDOI
Direct Wafer Bonding for Nanostructure Preparations
Hubert Moriceau,François Rieutord,C. Morales,Anne-Marie Charvet,O. Rayssac,Benoit Bataillou,F. Fournel,Joël Eymery,A. Pascale,Pascal Gentile,Alexis Bavard,Jérôme Meziere,Christophe Maleville,B. Aspar +13 more
Abstract: Direct Wafer Bonding has been widely developed and is very attractive for a lot of applications. Using original techniques based on direct bonding enable to carry out specific engineered substrates. Various illustrations are given among which twisted Si-Si bonded substrates, where buried dislocation networks play a key role in the subsequent elaboration of nanostructures.
Journal ArticleDOI
Strained Silicon On Insulator wafers made by the Smart Cut™ technology
B. Ghyselen,Y. Bogumilowicz,Cecile Aulnette,Alexandra Abbadie,Benedite Osternaud,Pascal Besson,Nicolas Daval,Francois Andrieu,I. Cayrefourq,Hubert Moriceau,Thomas Ernst,A. Tiberj,O. Rayssac,B. Blondeau,Carlos Mazure,C. Lagahe-Blanchard,S. Pocas,A.-M. Cartier,J.M. Hartmann,P. Leduc,C. Di Nardo,J.-F. Lugand,F. Fournel,M.N. Séméria,N. Kernevez,Y. Campidelli,Olivier Kermarrec,Yves Morand,M. Rivoire,D. Bensahel,Vincent Paillard,Laetitia Vincent,Alain Claverie,Philippe Boucaud +33 more
TL;DR: In this paper, the authors demonstrate how a layer transfer technique such as the Smart Cut technology can be used to obtain good quality tensile Strained Silicon On insulator wafers.
Book ChapterDOI
Smart Cut Technology: The Path for Advanced SOI Substrates
H. Moriceau,C. Lagahe-Blanchard,Franck Fournel,S. Pocas,E. Jalaguier,P. Perreau,Chrystel Deguet,T. Ernst,A. Beaumont,N. Kernevez,J.M. Hartman,B. Ghyselen,Cecile Aulnette,Fabrice Letertre,O. Rayssac,Bruce Faure,C. Richtarch,I. Cayrefourq +17 more
TL;DR: This paper focuses on the realization of advancedSOI, strained SOI, SOQ substrates and many other examples of engineered substrates.