Showing papers by "Stephen J. Pearton published in 2022"

Demonstration of 4.7 kV breakdown voltage in NiO/β-Ga2O3 vertical rectifiers

Abstract: Vertical heterojunction NiO/β n-Ga2O/n+ Ga2O3 rectifiers employing NiO layer extension beyond the rectifying contact for edge termination exhibit breakdown voltages (VB) up to 4.7 kV with a power figure-of-merits, VB2/RON of 2 GW·cm−2, where RON is the on-state resistance (11.3 mΩ cm2). Conventional rectifiers fabricated on the same wafers without NiO showed VB values of 840 V and a power figure-of-merit of 0.11 GW cm−2. Optimization of the design of the two-layer NiO doping and thickness and also the extension beyond the rectifying contact by TCAD showed that the peak electric field at the edge of the rectifying contact could be significantly reduced. The leakage current density before breakdown was 144 mA/cm2, the forward current density was 0.8 kA/cm2 at 12 V, and the turn-on voltage was in the range of 2.2–2.4 V compared to 0.8 V without NiO. Transmission electron microscopy showed sharp interfaces between NiO and epitaxial Ga2O3 and a small amount of disorder from the sputtering process.

Deep level defect states in β-, α-, and ɛ-Ga2O3 crystals and films: Impact on device performance

Abstract: A review is given of reported trap states in the bandgaps of different polymorphs of the emerging ultrawide bandgap semiconductor Ga2O3. The commonly observed defect levels span the entire bandgap range in the three stable (β) or meta-stable polymorphs (α and ɛ) and are assigned either to impurities such as Fe or to native defects and their complexes. In the latter case, the defects can occur during crystal growth or by exposure to radiation. Such crystalline defects can adversely affect material properties critical to device operation of transistors and photodetectors, including gain, optical output, threshold voltage by reducing carrier mobility, and effective carrier concentration. The trapping effects lead to degraded device operating speed and are characterized by long recovery transients. There is still significant work to be done to correlate experimental results based on deep level transient spectroscopy and related optical spectroscopy techniques to density functional theory and the dominant impurities present in the various synthesis methods to understand the microscopic nature of defects in Ga2O3.

Annealing temperature dependence of band alignment of NiO/β-Ga2O3

Abstract: The band alignment of sputtered NiO on β-Ga2O3 was measured by x-ray photoelectron spectroscopy for post-deposition annealing temperatures up to 600 °C. The band alignment is type II, staggered gap in all cases, with the magnitude of the conduction and valence band offsets increasing monotonically with annealing temperature. For the as-deposited heterojunction, ΔE V = −0.9 eV and ΔE C = 0.2 eV, while after 600 °C annealing the corresponding values are ΔE V = −3.0 eV and ΔE C = 2.12 eV. The bandgap of the NiO was reduced from 3.90 eV as-deposited to 3.72 eV after 600 °C annealing, which accounts for most of the absolute change in ΔE V−ΔE C. Differences in thermal budget may be at least partially responsible for the large spread in band offsets reported in the literature for this heterojunction. Other reasons could include interfacial disorder and contamination. Differential charging, which could shift peaks by different amounts and could potentially be a large source of error, was not observed in our samples.

Variable temperature probing of minority carrier transport and optical properties in p-Ga2O3

Abstract: Electron beam-induced current in the temperature range from 304 to 404 K was employed to measure the minority carrier diffusion length in metal–organic chemical vapor deposition-grown p-Ga2O3 thin films with two different concentrations of majority carriers. The diffusion length of electrons exhibited a decrease with increasing temperature. In addition, the cathodoluminescence emission spectrum identified optical signatures of the acceptor levels associated with the VGa−–VO++ complex. The activation energies for the diffusion length decrease and quenching of cathodoluminescence emission with increasing temperature were ascribed to the thermal de-trapping of electrons from VGa−–VO++ defect complexes.

Atomic-scale characterization of structural damage and recovery in Sn ion-implanted β-Ga2O3

Abstract: β-Ga2O3 is an emerging ultra-wide bandgap semiconductor, holding a tremendous potential for power-switching devices for next-generation high power electronics. The performance of such devices strongly relies on the precise control of electrical properties of β-Ga2O3, which can be achieved by implantation of dopant ions. However, a detailed understanding of the impact of ion implantation on the structure of β-Ga2O3 remains elusive. Here, using aberration-corrected scanning transmission electron microscopy, we investigate the nature of structural damage in ion-implanted β-Ga2O3 and its recovery upon heat treatment with the atomic-scale spatial resolution. We reveal that upon Sn ion implantation, Ga2O3 films undergo a phase transformation from the monoclinic β-phase to the defective cubic spinel [Formula: see text]-phase, which contains high-density antiphase boundaries. Using the planar defect models proposed for the [Formula: see text]-Al2O3, which has the same space group as β-Ga2O3, and atomic-resolution microscopy images, we identify that the observed antiphase boundaries are the {100}1/4 ⟨110⟩ type in cubic structure. We show that post-implantation annealing at 1100 °C under the N2 atmosphere effectively recovers the β-phase; however, nano-sized voids retained within the β-phase structure and a [Formula: see text]-phase surface layer are identified as remanent damage. Our results offer an atomic-scale insight into the structural evolution of β-Ga2O3 under ion implantation and high-temperature annealing, which is key to the optimization of semiconductor processing conditions for relevant device design and the theoretical understanding of defect formation and phase stability.

Point defect creation by proton and carbon irradiation of α-Ga2O3

Abstract: Films of α-Ga2O3 grown by Halide Vapor Phase Epitaxy (HVPE) were irradiated with protons at energies of 330, 400, and 460 keV with fluences 6 × 1015 cm−2 and with 7 MeV C4+ ions with a fluence of 1.3 × 1013 cm−2 and characterized by a suite of measurements, including Photoinduced Transient Current Spectroscopy (PICTS), Thermally Stimulated Current (TSC), Microcathodoluminescence (MCL), Capacitance–frequency (C–f), photocapacitance and Admittance Spectroscopy (AS), as well as by Positron Annihilation Spectroscopy (PAS). Proton irradiation creates a conducting layer near the peak of the ion distribution and vacancy defects distribution and introduces deep traps at Ec-0.25, 0.8, and 1.4 eV associated with Ga interstitials, gallium–oxygen divacancies VGa–VO, and oxygen vacancies VO. Similar defects were observed in C implanted samples. The PAS results can also be interpreted by assuming that the observed changes are due to the introduction of VGa and VGa–VO.

Structural and electrical properties of thick κ-Ga2O3 grown on GaN/sapphire templates

Abstract: Thick (23 µm) films of κ-Ga2O3 were grown by Halide Vapor Phase Epitaxy (HVPE) on GaN/sapphire templates at 630 °C. X-ray analysis confirmed the formation of single-phase κ-Ga2O3 with half-widths of the high-resolution x-ray diffraction (004), (006), and (008) symmetric reflections of 4.5 arc min and asymmetric (027) reflection of 14 arc min. Orthorhombic κ-Ga2O3 polymorph formation was confirmed from analysis of the Kikuchi diffraction pattern in electron backscattering diffraction. Secondary electron imaging indicated a reasonably flat surface morphology with a few (area density ∼103 cm−2) approximately circular (diameter ∼50–100 µm) uncoalesced regions, containing κ-Ga2O3 columns with in-plane dimensions and a height of about 10 µm. Micro-cathodoluminescence (MCL) spectra showed a wide 2–3.5 eV band that could be deconvoluted into narrower bands peaked at 2.59, 2.66, 2.86, and 3.12 eV. Ni Schottky diodes prepared on the films showed good rectification but a high series resistance. The films had a thin near-surface region dominated by Ec − 0.7 eV deep centers and a deeper region (∼2 µm from the surface) dominated by shallow donors with concentrations of ≤1016 cm−3. Photocurrent and photocapacitance spectra showed the presence of deep compensating acceptors with optical ionization energies of ∼1.35 and 2.3 eV, the latter being close to the energy of one of the MCL bands. Deep level transient spectroscopy revealed deep traps with energies near 0.3, 0.6, 0.7, 0.8, and 1 eV from the conduction band edge. The results show the potential of HVPE to grow very thick κ-Ga2O3 on GaN/sapphire templates.

Thermo-mechanical aspects of gamma irradiation effects on GaN HEMTs

Abstract: We report thermal and mechanical responses accompanying electrical characteristics of depletion mode GaN high electron mobility transistors exposed to gamma radiation up to 107 rads. Changes in the lattice strain and temperature were simultaneously characterized by changes in the phonon frequency of E2 (high) and A1 (LO) from the on-state and unpowered/pinched off reference states. Lower doses of radiation improved electrical properties; however, degradation initiated at about 106 rads. We observed about 16% decrease in the saturation current and 6% decrease in the transconductance at the highest dose. However, a leakage current increase by three orders of magnitude was the most notable radiation effect. We observed temperature increase by 40% and mechanical stress increase by a factor of three at a dose of 107 rads compared to the pristine devices. Spatial mapping of mechanical stress along the channel identifies the gate region as a mechanically affected area, whereas the thermal degradation was mostly uniform. Transmission electron microscopy showed contrast changes reflecting a high vacancy concentration in the gate region. These findings suggest that localized stress (mechanical hotspots) may increase vulnerability to radiation damage by accommodating higher concentration of defects that promote the leakage current.

Impact of radiation and electron trapping on minority carrier transport in p-Ga2O3

Abstract: Highly resistive undoped p-type gallium oxide samples were subjected to cumulative proton irradiation with energies ranging from 25 to 70 keV and doses in the 1.6 × 1014–3.6 × 1014 cm−2 range. Proton irradiation resulted in up to a factor of 2 reduction of minority electron diffusion length in the samples for temperatures between ∼ 300 and 400 K. Electron injection into the samples under test using a scanning electron microscope beam leads to pronounced elongation of diffusion length beyond the pre-irradiation values, thus demonstrating stable (days after injection) recovery of adverse radiation impact on minority carrier transport. The activation energy of 91 meV estimated from the temperature dependent diffusion length vs electron injection duration experiments is likely related to the local potential barrier height for native defects associated with the phenomenon of interest.

Electrical properties of α-Ga2O3 films grown by halide vapor phase epitaxy on sapphire with α-Cr2O3 buffers

Abstract: We report on growth and electrical properties of α-Ga2O3 films prepared by halide vapor phase epitaxy (HVPE) at 500 °C on α-Cr2O3 buffers predeposited on sapphire by magnetron sputtering. The α-Cr2O3 buffers showed a wide microcathodoluminescence (MCL) peak near 350 nm corresponding to the α-Cr2O3 bandgap and a sharp MCL line near 700 nm due to the Cr+ intracenter transition. Ohmic contacts to Cr2O3 were made with both Ti/Au or Ni, producing linear current–voltage ( I– V) characteristics over a wide temperature range with an activation energy of conductivity of ∼75 meV. The sign of thermoelectric power indicated p-type conductivity of the buffers. Sn-doped, 2- μm-thick α-Ga2O3 films prepared on this buffer by HVPE showed donor ionization energies of 0.2–0.25 eV, while undoped films were resistive with the Fermi level pinned at EC of 0.3 eV. The I– V and capacitance–voltage ( C– V) characteristics of Ni Schottky diodes on Sn-doped samples using a Cr2O3 buffer indicated the presence of two face-to-face junctions, one between n-Ga2O3 and p-Cr2O3, the other due to the Ni Schottky diode with n-Ga2O3. The spectral dependence of the photocurrent measured on the structure showed the presence of three major deep traps with optical ionization thresholds near 1.3, 2, and 2.8 eV. Photoinduced current transient spectroscopy spectra of the structures were dominated by deep traps with an ionization energy of 0.95 eV. These experiments suggest another pathway to obtain p–n heterojunctions in the α-Ga2O3 system.

Temperature dependence of on–off ratio and reverse recovery time in NiO/β-Ga2O3 heterojunction rectifiers

Abstract: The temperature-dependent behavior of on/off ratio and reverse recovery time in vertical heterojunction p-NiO/β n-Ga2O/n+ Ga2O3 rectifiers was investigated over the temperature range of 25–300 °C. The device characteristics in forward bias showed evidence of multiple current transport mechanisms and were found to be dependent on the applied bias voltages and temperatures. The on–off ratio decreased from 3 × 106 at 25 °C to 2.5 × 104 at 300 °C for switching to 100 V reverse bias. For 200 μm diameter rectifiers, the reverse recovery time of ∼21 ns was independent of temperature, with the Irr monotonically increasing from 15.1 mA at 25 °C to 25.6 mA at 250 °C and dropping at 300 °C. The dI/dt increased from 4.2 to 4.6 A/ μs over this temperature range. The turn-on voltage decreased from 2.9 V at 25 °C to 1.7 V at 300 °C. The temperature coefficient of breakdown voltage was negative and does not support the presence of avalanche breakdown in NiO/β-Ga2O3 rectifiers. The energy loss during switching from 100 V was in the range 23–31 μJ over the temperature range investigated.

Radiation Damage in the Ultra-Wide Bandgap Semiconductor Ga2O3

Abstract: Ga2O3 is expected to show similar radiation resistance to that of GaN and SiC. This is not enough to explain the orders of magnitude difference in the relative resistance to radiation damage of these materials compared to GaAs or why dynamic annealing of defects is much more effective in Ga2O3. Octahedral gallium monovacancies are the main defects produced under most radiation conditions because of the larger cross-section for interaction compared to oxygen vacancies. Proton irradiation introduces two main paramagnetic defects in Ga2O3, which are stable at room temperature. Charge carrier removal can be explained by Fermi-level pinning far from the conduction band minimum due to gallium interstitials, vacancies, and antisites. With few experimental or simulation studies on single event effects in Ga2O3 , it is apparent that while other wide bandgap semiconductors like SiC and GaN are robust against displacement damage and total ionizing dose, they display significant vulnerability to single event effects at high linear energy transfer and at much lower biases than expected. We have analyzed the transient response of β-Ga2O3 rectifiers to heavy-ion strikes via TCAD simulations. Using field metal rings improves the breakdown voltage and biasing those rings can help control the breakdown voltage.

H trapping at the metastable cation vacancy in α-Ga2O3 and α-Al2O3

Abstract: α-Ga2O3 has the corundum structure analogous to that of α-Al2O3. The bandgap energy of α-Ga2O3 is 5.3 eV and is greater than that of β-Ga2O3, making the α-phase attractive for devices that benefit from its wider bandgap. The O–H and O–D centers produced by the implantation of H+ and D+ into α-Ga2O3 have been studied by infrared spectroscopy and complementary theory. An O–H line at 3269 cm−1 is assigned to H complexed with a Ga vacancy (VGa), similar to the case of H trapped by an Al vacancy (VAl) in α-Al2O3. The isolated VGa and VAl defects in α-Ga2O3 and α-Al2O3 are found by theory to have a “shifted” vacancy-interstitial-vacancy equilibrium configuration, similar to VGa in β-Ga2O3, which also has shifted structures. However, the addition of H causes the complex with H trapped at an unshifted vacancy to have the lowest energy in both α-Ga2O3 and α-Al2O3.

Two-dimensional material templates for van der Waals epitaxy, remote epitaxy, and intercalation growth

Abstract: Epitaxial growth, a crystallographically oriented growth induced by the chemical bonding between crystalline substrate and atomic building blocks, has been a key technique in the thin-film and heterostructure applications of semiconductors. However, the epitaxial growth technique is limited by different lattice mismatch and thermal expansion coefficients of dissimilar crystals. Two-dimensional (2D) materials with dangling bond-free van der Waals surfaces have been used as growth templates for the hetero-integration of highly mismatched materials. Moreover, the ultrathin nature of 2D materials also allows for remote epitaxial growth and confinement growth of quasi-2D materials via intercalation. Here, we review the hetero-dimensional growth on 2D substrates: van der Waals epitaxy (vdWE), quasi vdWE, and intercalation growth. We discuss the growth mechanism and fundamental challenges for vdWE on 2D substrates. We also examine emerging vdWE techniques that use epitaxial liftoff and confinement epitaxial growth in detail. Finally, we give a brief review of radiation effects in 2D materials and contrast the damage induced with their 3D counterparts.

Impurity-hydrogen complexes in β-Ga2O3: Hydrogenation of shallow donors vs deep acceptors

Abstract: Substitutional impurities in β-Ga2O3 are used to make the material n-type or semi-insulating. Several O–H and O–D vibrational lines for complexes that involve impurities that are shallow donors and deep acceptors have been reported recently. The present article compares and contrasts the vibrational properties of complexes that involve shallow donors (OD-Si and OD-Ge) with complexes that involve deep acceptors (OD-Fe and OD-Mg). Theoretical analysis suggests that these results arise from defect complexes based on a shifted configuration of the Ga(1) vacancy with a trapped H atom and a nearby impurity.

High volume UV LED performance testing.

Abstract: There is increasing interest in deep UV Light-Emitting Diodes (LEDs) for applications in water purification, virus inactivation, sterilization, bioagent detection, and UV curing, as well as charge management control in the Laser Interferometer Space Antenna (LISA), which will be the first gravitational wave detector in space. To fully understand the current state of commercial UV LEDs and assess their performance for use on LISA, large numbers of UV LEDs need to be tested across a range of temperatures while operating in air or in a vacuum. We describe a new hardware system designed to accommodate a high volume of UV LED performance tests and present the performance testing results from over 200 UV LEDs with wavelengths in the 250 nm range.

Effects of sapphire substrate orientation on Sn-doped α-Ga2O3 grown by halide vapor phase epitaxy using α-Cr2O3 buffers

Abstract: Heavily Sn-doped films of α-Ga2O3 were grown by halide vapor phase epitaxy (HVPE) on basal plane c-sapphire and on (10-12) r-sapphire substrates with and without α-Cr2O3 thin buffers prepared by magnetron sputtering and annealing in air at 500 °C for 3 h. For both substrate orientations, the use of α-Cr2O3 buffers led to three major effects. The first was a substantial decrease of the half-width of the symmetric and asymmetric x-ray reflections. The second was an order of magnitude decrease of the net donor concentration produced by flowing the same amounts of Sn into the reactor. Third, there was a reduction in the concentration of the major electron trap in the films near E c − 1 eV by more than a factor of two. These results show the major influence of sapphire substrate orientation on the electrical and structural properties of α-Ga2O3 grown by HVPE.

Rapid SARS-CoV-2 diagnosis using disposable strips and a metal-oxide-semiconductor field-effect transistor platform.

Abstract: The SARS-CoV-2 pandemic has had a significant impact worldwide. Currently, the most common detection methods for the virus are polymerase chain reaction (PCR) and lateral flow tests. PCR takes more than an hour to obtain the results and lateral flow tests have difficulty with detecting the virus at low concentrations. In this study, 60 clinical human saliva samples, which included 30 positive and 30 negative samples confirmed with RT-PCR, were screened for COVID-19 using disposable glucose biosensor strips and a reusable printed circuit board. The disposable strips were gold plated and functionalized to immobilize antibodies on the gold film. After functionalization, the strips were connected to the gate electrode of a metal-oxide-semiconductor field-effect transistor on the printed circuit board to amplify the test signals. A synchronous double-pulsed bias voltage was applied to the drain of the transistor and strips. The resulting change in drain waveforms was converted to digital readings. The RT-PCR-confirmed saliva samples were tested again using quantitative PCR (RT-qPCR) to determine cycling threshold (Ct) values. Ct values up to 45 refer to the number of amplification cycles needed to detect the presence of the virus. These PCR results were compared with digital readings from the sensor to better evaluate the sensor technology. The results indicate that the samples with a range of Ct values from 17.8 to 35 can be differentiated, which highlights the increased sensitivity of this sensor technology. This research exhibits the potential of this biosensor technology to be further developed into a cost-effective, point-of-care, and portable rapid detection method for SARS-CoV-2.

Thermal stability of band offsets of NiO/β-GaN

Abstract: NiO is a promising alternative to p-GaN as a hole injection layer for normally-off lateral transistors or low on-resistance vertical heterojunction rectifiers. The valence band offsets of sputtered NiO on c-plane, vertical geometry homoepitaxial GaN structures were measured by x-ray photoelectron spectroscopy as a function of annealing temperatures to 600 °C. This allowed determination of the band alignment from the measured bandgap of NiO. This alignment was type II, staggered gap for both as-deposited and annealed samples. For as-deposited heterojunction, ΔEV = 2.89 eV and ΔEC = −2.39 eV, while for all the annealed samples, ΔEV values were in the range of 3.2–3.4 eV and ΔEC values were in the range of −(2.87–3.05) eV. The bandgap of NiO was reduced from 3.90 eV as-deposited to 3.72 eV after 600 °C annealing, which accounts for much of the absolute change in ΔEV − ΔEC. At least some of the spread in reported band offsets for the NiO/GaN system may arise from differences in their thermal history.

Non-Thermal Annealing of Gamma Irradiated GaN HEMTs with Electron Wind Force

Abstract: Radiation damage mitigation in electronics remains a challenge because the only established technique, thermal annealing, does not guarantee a favorable outcome. In this study, a non-thermal annealing technique is presented, where electron momentum from very short duration and high current density pulses is used to target and mobilize the defects. The technique is demonstrated on 60Co gamma irradiated (5 x 106 rad dose and 180 x 103 rad/hr dose rate) GaN high electron mobility transistors. The saturation current and maximum transconductance were fully and threshold voltage was partially recovered at 30°C or less. In comparison, thermal annealing at 300°C mostly worsened the post-irradiation characteristics. Raman spectroscopy showed an increase in defects that reduce the 2-dimensional electron gas (2DEG) concentration and increase the carrier scattering. Because the electron momentum force is not applicable to the polymeric surface passivation, the proposed technique could not recover the gate leakage current, but performed better than thermal annealing. The findings of this study may benefit the mitigation of some forms of radiation damage in electronics that are difficult to achieve with thermal annealing.

Nanoscale Stress Localization Effects on the Radiation Susceptibility of GaN High‐Mobility Transistors

Abstract: Nanoscale localized mechanical stress fields develop unavoidably in microelectronic devices due to structural and processing aspects. Their global average is too small to influence bandgap or mobility, but it is proposed that stress localization can influence defect nucleation sites under radiation. This is investigated on gallium nitride high‐electron‐mobility transistors (GaN HEMTs). Using transmission electron microscopy, we spatially resolved the stress field in the AlGaN layer for both pristine and 10 Mrad gamma‐irradiated HEMTs. The quantitative nanobeam electron diffraction and geometric phase analysis indicate that tensile stressed localizations experience higher radiation‐induced strain. This finding is explained by the tensile stress dependence of the carrier concentration and mobility in the AlGaN layer. Since gamma radiation damage is inflicted by high‐energy electrons only, localized regions of higher tensile stress in the AlGaN layer are expected to be more susceptible to gamma rays.

Ga+-focused ion beam damage in n-type Ga2O3

Abstract: Focused Ga+ ion milling of lightly Si-doped, n-type Ga2O3 was performed with 2–30 kV ions at normal incidence and beam currents that were a function of beam voltage, 65 nA for 30 kV, 26 nA for 10 kV, 13 nA for 5 kV, and 7.1 nA for 2 kV, to keep the milling depth constant at 100 nm. Approximate milling rates were 15, 6, 2.75, and 1.5 μm3/s for 30, 10, 5, and 2 kV, respectively. The electrical effects of the ion damage were characterized by Schottky barrier height and diode ideality factor on vertical rectifier structures comprising 10 μm epitaxial n-Ga2O3 on n+ Ga2O3 substrates, while the structural damage was imaged by transmission electron microscopy. The reverse bias leakage was largely unaffected even by milling at 30 kV beam energy, while the forward current-voltage characteristics showed significant deterioration at 5 kV, with an increase in the ideality factor from 1.25 to 2.25. The I–V characteristics no longer showed rectification for the 30 kV condition. Subsequent annealing up to 400 °C produced substantial recovery of the I–V characteristics for all beam energies and was sufficient to restore the initial ideality factor completely for beam energies up to 5 kV. Even the 30 kV-exposed rectifiers showed a recovery of the ideality factor to 1.8. The surface morphology of the ion-milled Ga2O3 was smooth even at 30 kV ion energy, with no evidence for preferential sputtering of the oxygen. The surface region was not amorphized by extended ion milling (35 min) at 5 kV with the samples held at 25 °C, as determined by electron diffraction patterns, and significant recovery of the lattice order was observed after annealing at 400 °C.

Digital biosensor for human cerebrospinal fluid detection with single-use sensing strips.

Abstract: Leakage of human cerebrospinal fluid (CSF) caused by trauma or other reasons presents exceptional challenges in clinical analysis and can have severe medical repercussions. Conventional test methods, including enzyme-linked immunosorbent assay and immunofixation electrophoresis testing, typically are performed at a few clinical reference laboratories, which may potentially delay proper diagnosis and treatment. At the same time, medical imaging can serve as a secondary diagnosis tool. This work presented here reports the use of a point-of-care electrochemical sensor for detection of beta-2-transferrin (B2T), a unique isomer of transferrin that is present exclusively in human CSF but is absent in other bodily fluids. Limits of detection were examined via serial dilution of human samples with known B2T concentrations down to 7 × 10-12 g B2T/ml while maintaining excellent sensitivity. Nine human samples with varying levels of B2T were compared using up to 100 times dilution to confirm the validity of sensor output across different patient samples.

Dynamic Switching of 1.9 A /1.76 kV Forward Current NiO/β-Ga2O3 Rectifiers

Abstract: The switching performance of vertical geometry NiO/β-Ga2O3 rectifiers with a reverse breakdown voltage of 1.76 kV (0.1 cm diameter, 7.85 x10-3 cm2 area) and an absolute forward current of 1.9 A fabricated on 20 µm thick epitaxial β-Ga2O3 drift layers and a double layer of NiO to optimize breakdown and contact resistance was measured with an inductive load test circuit. The Baliga figure-of-merit of the devices was 175 MW.cm-2, with on-state resistance of 17.8 mΩ.cm2. The recovery characteristics for these rectifiers switching from forward current of 1 A to reverse off-state voltage of -550 V showed a recovery time (trr) of 101 ns, with a peak current value of 1.4A for switching from 640V. There was no significant dependence of trr on switching voltage or forward current.

Band Alignment of Al2O3 on α-(AlxGa1-x)2O3

Abstract: X-Ray photoelectron spectroscopy was used to measure valence band offsets for Al2O3 deposited by atomic layer deposition on α-(AlxGa1-x)2O3 alloys over a wide range of Al contents, x, from 0.26-0.74, corresponding to a bandgap range from 5.8-7 eV. These alloys were grown by pulsed laser deposition. The band alignments were type I (nested) at x <0.5, with valence band offsets 0.13 eV for x=0.26 and x=0.46. At higher Al contents, the band alignment was a staggered alignment, with valence band offsets of - 0.07 eV for x=0.58 and -0.17 for x= 0.74, ie. negative valence band offsets in both cases. The conduction band offsets are also small at these high Al contents, being only 0.07 eV at x=0.74. The wide bandgap of the α-(AlxGa1-x)2O3 alloys makes it difficult to find dielectrics with nested band alignments over the entire composition range.

Gamma radiation on gallium nitride high electron mobility transistors at ON, OFF, and prestressed conditions

Abstract: Radiation damage in electronic devices is known to be influenced by physics, design, and materials system. Here, we report the effects of biasing state (such as ON and OFF) and pre-existing damage in GaN high electron mobility transistors exposed to γ radiation. Controlled and accelerated DC biasing was used to prestress the devices, which showed significant degradation in device characteristics compared to pristine devices under ON and OFF states after γ irradiation. The experiment is performed in situ for the ON-state to investigate transient effects during irradiation until the total dose reaches 10 Mrad. It shows that threshold voltage, maximum transconductance, and leakage current initially decrease with dosage but slowly converge to a steady value at higher doses. After 10 Mrad irradiation, the OFF-state device demonstrates larger RON and one order of magnitude increased leakage current compared to the ON-state irradiated device. The micro-Raman study also confirms that the ON-state operation shows more radiation hardness than OFF and prestressed devices. Prestressed devices generate the highest threshold voltage shift from −2.85 to −2.49 V and two orders of magnitude higher leakage current with decreased saturation current after irradiation. These findings indicate that high electric fields during stressing can generate defects by modifying strain distribution, and higher defect density can not only create more charges during irradiation but also accelerate the diffusion process from the ionizing track to the nearest collector and consequently degrade device performances.

Growth and characterization of α-Ga2O3 on sapphire and nanocrystalline β-Ga2O3 on diamond substrates by halide vapor phase epitaxy

Abstract: Halide vapor phase epitaxial (HVPE) Ga2O3 films were grown on c-plane sapphire and diamond substrates at temperatures up to 550 °C without the use of a barrier dielectric layer to protect the diamond surface. Corundum phase α-Ga2O3 was grown on the sapphire substrates, whereas the growth on diamond resulted in regions of nanocrystalline β-Ga2O3 (nc-β-Ga2O3) when oxygen was present in the HVPE reactor only during film growth. X-ray diffraction confirmed the growth of α-Ga2O3 on sapphire but failed to detect any β-Ga2O3 reflections from the films grown on diamond. These films were further characterized via Raman spectroscopy, which revealed the β-Ga2O3 phase of these films. Transmission electron microscopy demonstrated the nanocrystalline character of these films. From cathodoluminescence spectra, three emission bands, UVL′, UVL, and BL, were observed for both the α-Ga2O3/sapphire and nc-Ga2O3/diamond, and these bands were centered at approximately 3.7, 3.2, and 2.7 eV.

Communication—Electron-Beam Stimulated Release of Dislocations from Pinning Sites in GaN

Abstract: To achieve low leakage in GaN-based power devices and improve reliability in optoelectronic devices such as laser diodes, it is necessary to reduce dislocation density in epitaxial layers and control their introduction during processing. We have previously shown that dislocations can be introduced at room temperature in GaN. The effect of electron-beam irradiation at fixed points on the shift of such freshly introduced dislocations in GaN is reported. Dislocations can be displaced up to 10-15 µm from the beam position. We conclude the main reason limiting the dislocation travelling distance is the existence of a high number of pinning sites.