V
Vadim V. Silberschmidt
Researcher at Loughborough University
Publications - 592
Citations - 10904
Vadim V. Silberschmidt is an academic researcher from Loughborough University. The author has contributed to research in topics: Machining & Finite element method. The author has an hindex of 44, co-authored 543 publications receiving 8619 citations. Previous affiliations of Vadim V. Silberschmidt include University of Rhode Island & Universities UK.
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Journal ArticleDOI
Characterisation of Additively Manufactured Metallic Stents
Enzoh Langi,Anuj Bisht,Vadim V. Silberschmidt,Pablo D. Ruiz,Felix Vogt,Lucas Mailto,Lukas Masseling,Liguo Zhao +7 more
TL;DR: In this paper, microstructural characterisation of metallic stents produced with additive manufacturing, a promising technique to deliver patient-specific stents, was performed using a JEOL 7100F scanning electron microscope, with simultaneous elemental analysis using energy dispersive x-ray spectroscopy (EDS) and orientation analysis with electron backscatter diffraction.
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Finite-Element Simulations of Split Hopkinson Test of Ti-Based Alloy
TL;DR: In this article, a computational study on a three-dimensional finite element model of the split Hopkinson pressure bar (SHPB) experiment is performed to assess various features of the underlying mechanics of deformation processes at high-strain and -strain-rate regimes.
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Effect of crack induced nonlinearity on dynamics of structures: application to structural health monitoring
TL;DR: In this paper, the authors investigated the effect of crack-induced nonlinearity on the dynamics of a beam with a breathing crack excited longitudinally, and found that the crack induced non-linearity had a localized effect on dynamics of the beam.
Proceedings ArticleDOI
Anisotropic Elastic-Plastic Mechanical Properties of Thermally Bonded Bicomponent Fibre Nonwovens
TL;DR: In this paper, anisotropic elastic-plastic mechanical properties of core/sheath type thermally bonded bicomponent fiber nonwoven textiles are computed based on manufacturing parameters and fiber properties.
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Analysis of Stress Distribution in SnAgCu Solder Joint
TL;DR: In this paper, the residual stresses in solder joints in a flip chip package under different cooling conditions and their influence on the subsequent cyclic test by means of a finite element approach were investigated.