Institution
Cree Inc.
Company•Shenzhen, China•
About: Cree Inc. is a company organization based out in Shenzhen, China. It is known for research contribution in the topics: Layer (electronics) & Silicon carbide. The organization has 1014 authors who have published 2436 publications receiving 64884 citations.
Papers published on a yearly basis
Papers
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02 Nov 2001TL;DR: In this article, the authors proposed a semiconductor structure for light emitting devices that can emit in the red to ultraviolet portion of the electromagnetic spectrum, which is characterized by the absence of gallium in one or more of these structural layers.
Abstract: The present invention is a semiconductor structure for light emitting devices that can emit in the red to ultraviolet portion of the electromagnetic spectrum. The semiconductor structure includes a first cladding layer of a Group III nitride, a second cladding layer of a Group III nitride, and an active layer of a Group III nitride that is positioned between the first and second cladding layers, and whose bandgap is smaller than the respective bandgaps of the first and second cladding layers. The semiconductor structure is characterized by the absence of gallium in one or more of these structural layers.
23 citations
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21 Jun 2004TL;DR: In this paper, the authors present the latest results in 10 kV 4H-SiC DMOSFET development -a specific on-resistance of 123 m/spl Omega/spl middot/cm/sup 2/ is demonstrated, which is a 42% reduction in specific onresistance.
Abstract: Power MOSFETs in 4H-SiC are very attractive for high voltage switching applications because of their low specific on-resistances and fast, temperature independent switching characteristics. We present our latest results in 10 kV 4H-SiC DMOSFET development - a specific on-resistance of 123 m/spl Omega//spl middot/cm/sup 2/ is demonstrated, which is a 42% reduction in specific on-resistance. This is the lowest specific on-resistance value ever reported for 10 kV class majority carrier switches.
22 citations
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31 Jan 2014TL;DR: In this paper, a light emitting device may be controlled to permit transitioning between different modes of operation of multiple LED components, with aggregated output of different modes having different S/P ratios but similar chromaticities.
Abstract: Solid state light emitting devices include multiple LED components separately arranged to generate spectral output having different ratios of scotopic to photopic light (S/P ratios) but similar chromaticities preferably within seven MacAdam ellipses. A light emitting device may be controlled to permit transitioning between different modes of operation of multiple LED components, with aggregated output of different modes having different S/P ratios but similar chromaticities. Multiple LED components of a light emitting device may be simultaneously controlled with different dimming profiles to effect increased color rendering at maximum emissive output of the apparatus, and to effect increased aggregated S/P ratio at minimum emissive output of the device.
22 citations
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06 Dec 2004TL;DR: In this paper, high electron mobility transistors (HEMT) are provided having an output power of greater than 3.0 Watts when operated at a frequency of at least 30 GHz.
Abstract: High electron mobility transistors (HEMT) are provided having an output power of greater than 3.0 Watts when operated at a frequency of at least 30 GHz. The HEMT has a power added efficiency (PAE) of at least about 20 percent and/or a gain of at least about 7.5 dB. The total width of the HEMT is less than about 6.0 mm.
22 citations
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30 Jul 1993TL;DR: In this article, a method of obtaining high quality passivation layers on silicon carbide surfaces by oxidizing a sacrificial layer of a silicon-containing material on a siliconcarbide portion of a device structure was proposed.
Abstract: of EP0637069A method of obtaining high quality passivation layers on silicon carbide surfaces by oxidizing a sacrificial layer of a silicon-containing material on a silicon carbide portion of a device structure to substantially consume the sacrificial layer to produce an oxide passivation layer on the silicon carbide portion that is substantially free of dopants that would otherwise degrade the electrical integrity of the oxide layer. The oxidizing of the sacrificial layer is preferably achieved by thermal oxidizing. The silicon carbide portion may be of p-type silicon carbide which is aluminium doped.
22 citations
Authors
Showing all 1018 results
Name | H-index | Papers | Citations |
---|---|---|---|
Steven P. DenBaars | 118 | 1366 | 60343 |
Umesh K. Mishra | 96 | 912 | 42012 |
Umesh Mishra | 60 | 213 | 9757 |
Joan M. Redwing | 59 | 361 | 12590 |
Bernd Keller | 57 | 214 | 12852 |
Peter Andrews | 55 | 206 | 10549 |
Gerald H. Negley | 51 | 200 | 8756 |
Anant K. Agarwal | 50 | 376 | 9752 |
Paul T. Fini | 46 | 109 | 8309 |
John W. Palmour | 46 | 202 | 8835 |
Yifeng Wu | 46 | 122 | 11227 |
Adam William Saxler | 44 | 170 | 6634 |
John W. Palmour | 43 | 301 | 6908 |
Sten Heikman | 43 | 108 | 6399 |
Antony Paul Van de Ven | 41 | 126 | 4586 |