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Journal ArticleDOI

A fast prototyping process for fabrication of microfluidic systems on soda-lime glass

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TLDR
In this article, a microfluidic channel with a depth of 35.95±0.39 µm is formed after 40 min buffered oxide etching in an ultrasonic bath.
Abstract
This paper describes a fast, low-cost but reliable process for the fabrication of microfluidic systems on soda-lime glass substrates. Instead of using an expensive metal or polisilicon/nitride layer as an etch mask, a thin layer of AZ 4620 positive photoresist (PR) is used for buffered oxide etching (BOE) of soda-lime glass. A novel two-step baking process prolongs the survival time of the PR mask in the etchant, which avoids serious peeling problems of the PR. A new process to remove precipitated particles generated during the etching process is also reported in which the glass substrate is dipped into a 1 M hydrochloride solution. A microfluidic channel with a depth of 35.95±0.39 µm is formed after 40 min BOE in an ultrasonic bath. The resulting channel has a smooth profile with a surface roughness of less than 45.95±7.96 A. Glass chips with microfluidic channels are then bonded at 580 °C for 20 min to seal the channel while a slight pressure is applied. A new bonding process has been developed such that the whole process can be finished within 10 h. To our knowledge, this is the shortest processing time that has ever been reported. In the present study, an innovative microfluidic device, a `micro flow-through sampling chip', has been demonstrated using the fabrication method. Successful sampling and separation of Cy5-labelled bovine serum albumin (BSA) and anti-BSA has been achieved. This simple fabrication process is suitable for fast prototyping and mass production of microfluidic systems.

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Citations
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Industrial lab-on-a-chip: Design, applications and scale-up for drug discovery and delivery

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Fabrication and characterization of 20 nm planar nanofluidic channels by glass-glass and glass-silicon bonding.

TL;DR: It is demonstrated that glass-glass nanofluidic channels as shallow as 25 nm with low aspect ratio of 0.0005 (depth to width) can be achieved with the developedGlass-glass bonding technique, and it is shown that there is no significant change in the depth of the nanof LU channels due to anodic bonding and glass- glass fusion bonding processes.
References
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Journal ArticleDOI

Capillary electrophoresis and sample injection systems integrated on a planar glass chip

TL;DR: In this article, a complex manifold of capillary channels has been fabricated in a planar glass substrate and the separation of a mixture of fluorescein and calcein within the channels was achieved using electrophoresis.
Book

Micromachined Transducers Sourcebook

TL;DR: In this paper, the authors present an overview of Micromachining Techniques, Mechanical Transducers, Optical Transducers and Ionizing Radiation Transducers for Microfluidic Devices.
Journal ArticleDOI

Ultra-high-speed DNA fragment separations using microfabricated capillary array electrophoresis chips.

TL;DR: Methods for high-speed, high-throughput DNA separations on capillary array electrophoresis chips are established and high-resolution electrophoretic separations of phi X174 Hae III DNA restriction fragments are performed using a hydroxyethyl cellulose sieving matrix in the channels.
Journal ArticleDOI

Glass chips for high-speed capillary electrophoresis separations with submicrometer plate heights

TL;DR: Micromachined capillary electrophoresis systems with integrated sample injection have been fabricated on glass chips using standard photolithographic and etching techniques as mentioned in this paper, which permits volume-defined electrokinetic sample injection without sample biasing.
Journal ArticleDOI

High-Speed Separations on a Microchip

TL;DR: In this paper, a glass microchip device for free solution electrophoresis was fabricated using standard photolithographic procedures and chemical wet etching, and separation was performed at several separation lengths from the injector to the detector with electric field strengths from 0.06 to 1.5 kV/cm.
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