Analytic modeling, optimization, and realization of cooling devices in silicon technology

TLDR: In this paper, a cooling device based on micro-micromachining of the bottom side of the circuit wafer is presented, where microchannels and inlet-outlet nozzles are micromachined.

Abstract: A novel cooling device fully built in silicon technology is presented. The new concept developed in this work consists of micromachining the bottom side of the circuit wafer in order to embed heat sinking microchannels directly into the silicon material. These microchannels are then sealed, by a direct wafer bonding procedure, with another silicon wafer where microchannels and inlet-outlet nozzles are micromachined too. A cooling fluid (water) is then forced through the array of channel to convey heat outside the chip. Such a configuration presents advantages to provide a significant reduction of the cooler overall dimensions, to reduce the number of the involved materials and to be compatible with integrated circuit fabrication procedures, In this study analytical tools were used in order to get a global evaluation of all the thermal resistances characteristic of such devices. Using these adequate analytic models with appropriate approximations, a global optimization procedure was then applied and led to the definition of he optimum dimensions of the silicon micro heat sink. The realization procedure was then carried out in a clean room environment. First experimental characterization results obtained from the earlier prototypes demonstrated that the thermal properties of this silicon-based cooling device are satisfactory and can be reasonably compared to those of commercially available copper micro heat sinking components.