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Circuits and methods for a memory cell with a trench plate trench capacitor and a vertical bipolar read device

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TLDR
In this paper, an n-channel field effect transistor coupled between a memory cell and a data communication line is described, and an NPN bipolar junction transistor is also coupled between the memory cells and the data communication lines in parallel to the N-channel access transistor.
Abstract
A memory device is described which has an n-channel field effect transistor coupled between a memory cell and a data communication line. An NPN bipolar junction transistor is also coupled between the memory cell and the data communication line in parallel to the n-channel access transistor. A base connection of the NPN bipolar junction transistor is described as coupled to a body of the n-channel access transistor. During operation the n-channel field effect transistor is used for writing data to a memory cell, while the NPN bipolar junction transistor is used for read operations in conjunction with a current sense amplifier circuit. The access transistors are described as fabricated as a single vertical pillar.

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Citations
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References
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Journal ArticleDOI

The Physics of Macropore Formation in Low‐Doped p‐Type Silicon

TL;DR: In this article, the pore walls in hydrofluoric acid are caused by a depletion of holes due to the n-type doping of the substrate, and the dimensions of the pores are estimated based on these findings.
Journal ArticleDOI

Experimental results and modeling techniques for substrate noise in mixed-signal integrated circuits

TL;DR: In this paper, the effects of switching transients in digital MOS circuits that perturb analog circuits integrated on the same die by means of coupling through the substrate were observed. But the authors did not consider the effect of the layout geometry of the substrate.
Journal ArticleDOI

Al3O3 thin film growth on Si(100) using binary reaction sequence chemistry

TL;DR: In this article, Al2O3 films with precisely controlled thicknesses and excellent conformality were grown on Si(100) at low temperatures of 350-650 K using sequential surface chemical reactions.
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Current-mode techniques for high-speed VLSI circuits with application to current sense amplifier for CMOS SRAM's

TL;DR: In this article, a simple four-transistor current sense amplifier for fast CMOS SRAMs is proposed, which presents a virtual short circuit to the bit lines, thus reducing the sensing delay, which is rendered practically insensitive to bit-line capacitance.
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High-density electronic package comprising stacked sub-modules which are electrically interconnected by solder-filled vias

TL;DR: In this paper, a high-density package containing identical multiple IC chips is disclosed, which is assembled from submodules interleaved with frame-like spacers, and each submodule comprises a rectangular, wafer-like substrate.