Comparison of Packaging Technologies for RF MEMS Switch
TLDR
In this article, an integrated approach for design, fabrication and encapsulation of RF MEMS switches in view of the optimal performance subsequent to packaging is described. But the authors focus on the bottom contact package (BCP), where the connection layout through silicon via holes is independent of the cavity geometry.Abstract:
The present paper describes an integrated approach for design, fabrication and encapsulation of RF MEMS switches in view of the optimal performance subsequent to packaging. 'Top and bottom contact' fabrication approaches are explored using different RF MEMS switch topologies. In the 'bottom contact package (BCP)' the packaging cap alignment is less critical as compared to the top contact packaging (TCP) approach where contact via is an integral part of the cap. In this case, the connection layout through silicon via holes is independent of the cavity geometry. For the devices under consideration, bulk etched silicon cavity height has been optimized to 50µm for optimal RF performance, e.g., isolation and insertion loss. Parasitic effects of top silicon cap are reduced by altering CPW impedance. Mechanical parameter damping is simulated for different cavity heights and found to be independent from cavity height after 20µ mo nwards.read more
Citations
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Journal ArticleDOI
Fabrication and analysis of radiofrequency MEMS series capacitive single-pole double-throw switch
TL;DR: In this paper, a single-pole double-throw (SPDT) switch based on series capacitive configuration is proposed, and the critical process parameters are analyzed to improve the fabrication process.
Journal ArticleDOI
Wafer-level micropackaging in thin film technology for RF MEMS applications
Anna Persano,Pietro Siciliano,Fabio Quaranta,Antonietta Taurino,Andrea Lucibello,Romolo Marcelli,Giovanni Capoccia,Emanuela Proietti,Alvise Bagolini,Jacopo Iannacci +9 more
TL;DR: In this paper, a thin-film packaging was developed to be used for radio-frequency microelectromechanical system configurations, where the fabricated packages are suspended membranes in the multilayer SixNy/aSi/SixNy on conductive coplanar waveguides of different lengths.
Journal ArticleDOI
Design and fabrication of a reduced stiction radio frequency MEMS switch
Deepak Bansal,Deepak Bansal,Anuroop Bajpai,Pramod Kumar,Amit Kumar,Amit Kumar,Maninder Kaur,Kamaljit Rangra,Kamaljit Rangra +8 more
TL;DR: In this article, the design, fabrication, and mechanical characterization of a compact-reduced stiction see-saw radio frequency MEMS switch is presented, which has a resonance frequency of 9.8 kHz with a corresponding switching speed of 46μs.
Proceedings ArticleDOI
Wafer-level thin film micropackaging for RF MEMS applications
Anna Persano,Pietro Siciliano,Fabio Quaranta,Andrea Lucibello,Romolo Marcelli,Giovanni Capoccia,Emanuela Proietti,Alvise Bagolini,Jacopo Iannacci +8 more
TL;DR: In this article, thin-film packages were developed for radiofrequency microelectromechanical system (RF MEMS) configurations, which are suspended membranes in the multilayer SixNyHz/aSi/SixNyMHz on conductive coplanar lines of different lengths.
Proceedings ArticleDOI
Change of characteristic length with packaging for torsional MEMS switch
Deepak Bansal,Anuroop,Prem Kumar,Maninder Kaur,Surender P. Gaur,Prateek Kothari,Arvind Singh,Kamaljit Rangra +7 more
TL;DR: In this article, the authors derived the effective characteristic length with reference to the packaging height of an open MEMS device and modified it with the packaging cavity height to obtain the gap between the MEMS bridge and underneath actuation electrodes.
References
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Proceedings ArticleDOI
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